Brass bonding using copper nanoparticles and zinc powder for packaging of power electronic devices
Satoh, Toshikazu, Kume, Yasuhiro, Usui, Masanori
Published in Journal of alloys and compounds (05.06.2019)
Published in Journal of alloys and compounds (05.06.2019)
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Journal Article
Reliability of Cu Nanoparticles/Bi-Sn Solder Hybrid Bonding Under Cyclic Thermal Stresses
Usui, Masanori, Satoh, Toshikazu, Kamiyama, Michiaki, Kimura, Hidehiko
Published in JOM (1989) (01.02.2021)
Published in JOM (1989) (01.02.2021)
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Journal Article
Behavior of thin copper oxide on silver as an analogue for copper nanoparticles
Satoh, Toshikazu, Ishizaki, Toshitaka, Akedo, Kunio
Published in Journal of alloys and compounds (15.01.2017)
Published in Journal of alloys and compounds (15.01.2017)
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Journal Article
Silver Adhesive Layer for Enhanced Pressure-Free Bonding Using Copper Nanoparticles
Satoh, Toshikazu, Ishizaki, Toshitaka, Akedo, Kunio
Published in Journal of electronic materials (01.02.2017)
Published in Journal of electronic materials (01.02.2017)
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Journal Article
X-ray photoelectron spectroscopic study of the formation of Cu/Ni interface mediated by oxide phase
Satoh, Toshikazu, Akedo, Kunio, Ishizaki, Toshitaka
Published in Journal of alloys and compounds (05.01.2014)
Published in Journal of alloys and compounds (05.01.2014)
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Journal Article
Pressure-Free Bonding of Metallic Plates with Ni Affinity Layers Using Cu Nanoparticles
Ishizaki, Toshitaka, Akedo, Kunio, Satoh, Toshikazu, Watanabe, Ryota
Published in Journal of electronic materials (01.03.2014)
Published in Journal of electronic materials (01.03.2014)
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Journal Article
Photoemission Spectroscopy of the Interface between Indium-Tin-Oxide and Copper Phthalocyanine for Transparent Organic Light-Emitting Devices
Isomura, Noritake, Satoh, Toshikazu, Suzuki, Motofumi, Ohwaki, Takeshi, Taga, Yasunori
Published in Japanese Journal of Applied Physics (01.10.2001)
Published in Japanese Journal of Applied Physics (01.10.2001)
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Journal Article