by Sasangka, W. A., Syaranamual, G. J., Made, R. I., Thompson, C. V., Gan, C. L.
Published in AIP advances (01.09.2016)

by Yufei Wu, Sasangka, W. A., del Alamo, Jesus A.
Published in IEEE transactions on electron devices (01.11.2017)

by Tan, H.T., Gao, Y., Syaranamual, G.J., Sasangka, W.A., Foo, S.C., Lee, K.H., Arulkumaran, S., Ng, G.I., Thompson, C.V., Gan, C.L.
Published in Microelectronics and reliability (01.11.2023)

by Gao, Y., Sasangka, W.A., Thompson, C.V., Gan, C.L.
Published in Microelectronics and reliability (01.09.2019)

by Sasangka, W.A., Gao, Y., Gan, C.L., Thompson, C.V.
Published in Microelectronics and reliability (01.09.2018)

by Sasangka, W.A., Syaranamual, G.J., Gao, Y., I Made, R., Gan, C.L., Thompson, C.V.
Published in Microelectronics and reliability (01.09.2017)

by Syaranamual, G.J., Sasangka, W.A., Made, R.I., Arulkumaran, S., Ng, G.I., Foo, S.C., Gan, C.L., Thompson, C.V.
Published in Microelectronics and reliability (01.09.2016)

by Made, R.I, Gao, Yu, Syaranamual, G.J., Sasangka, W.A., Zhang, L., Nguyen, Xuan Sang, Tay, Y.Y., Herrin, J.S., Thompson, C.V., Gan, C.L.
Published in Microelectronics and reliability (01.09.2017)

by Sasangka, W. A., Syaranamual, G. J., Gan, C. L., Thompson, C. V.
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)

by Gan, C. L., Sasangka, W. A., Thompson, C. V.
Published in 2019 Electron Devices Technology and Manufacturing Conference (EDTM) (01.03.2019)

by Sasangka, Wardhana A., Gan, Chee Lip, Thompson, Carl V., Choi, Won Kyoung, Wei, Jun
Published in Journal of electronic materials (01.11.2011)

by Sasangka, W. A., Gan, C. L., Thompson, C. V.
Published in 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2011)

by Sasangka, W.A., Gan, C.L., Thompson, C.V., Choi, W.K., Wei, J.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)