Monolithic Microfluidic Cooling of a Heterogeneous 2.5-D FPGA With Low-Profile 3-D Printed Manifolds
Rajan, Sreejith Kochupurackal, Kaul, Ankit, Sarvey, Thomas E., May, Gary S., Bakir, Muhannad S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2021)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2021)
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Journal Article
Microfluidic Cooling of a 14-nm 2.5-D FPGA With 3-D Printed Manifolds for High-Density Computing: Design Considerations, Fabrication, and Electrical Characterization
Sarvey, Thomas E., Kaul, Ankit, Rajan, Sreejith Kochupurackal, Dasu, Aravind, Gutala, Ravi, Bakir, Muhannad S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2019)
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Journal Article
Monolithic Integration of a Micropin-Fin Heat Sink in a 28-nm FPGA
Sarvey, Thomas E., Yang Zhang, Cheung, Colman, Gutala, Ravi, Rahman, Arifur, Dasu, Aravind, Bakir, Muhannad S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2017)
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Journal Article
Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power Maps
Sarvey, Thomas E., Yuanchen Hu, Green, Craig E., Kottke, Peter A., Woodrum, David C., Joshi, Yogendra K., Fedorov, Andrei G., Sitaraman, Suresh K., Bakir, Muhannad S.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2017)
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Journal Article
Dynamic Thermal Management for 3-D ICs With Time-Dependent Power Map Using Microchannel Cooling and Machine Learning
Yong-Sheng Li, Huan Yu, Hang Jin, Sarvey, Thomas E., Hanju Oh, Bakir, Muhannad S., Swaminathan, Madhavan, Er-Ping Li
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2019)
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Journal Article
Embedded cooling technologies for densely integrated electronic systems
Sarvey, Thomas E., Yang Zhang, Li Zheng, Thadesar, Paragkumar, Gutala, Ravi, Cheung, Colman, Rahman, Arifur, Bakir, Muhannad S.
Published in 2015 IEEE Custom Integrated Circuits Conference (CICC) (01.09.2015)
Published in 2015 IEEE Custom Integrated Circuits Conference (CICC) (01.09.2015)
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Conference Proceeding
Flow visualization of two phase flow of R245fa in a microgap with integrated staggered pin fins
Asrar, Pouya, Xuchen Zhang, Green, Craig E., Kottke, Peter A., Sarvey, Thomas E., Fedorov, Andrei, Bakir, Muhannad S., Joshi, Yogendra K.
Published in 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (01.03.2016)
Published in 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (01.03.2016)
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Conference Proceeding
Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering
Lorenzini, Daniel, Green, Craig, Sarvey, Thomas E., Zhang, Xuchen, Hu, Yuanchen, Fedorov, Andrei G., Bakir, Muhannad S., Joshi, Yogendra
Published in International journal of heat and mass transfer (01.12.2016)
Published in International journal of heat and mass transfer (01.12.2016)
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Journal Article
Flow regimes and convective heat transfer of refrigerant flow boiling in ultra-small clearance microgaps
Nasr, Mohamed H., Green, Craig E., Kottke, Peter A., Zhang, Xuchen, Sarvey, Thomas E., Joshi, Yogendra K., Bakir, Muhannad S., Fedorov, Andrei G.
Published in International journal of heat and mass transfer (01.05.2017)
Published in International journal of heat and mass transfer (01.05.2017)
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Journal Article
Numerical and experimental exploration of thermal isolation in 3D systems using air gap and mechanically flexible interconnects
Yang Zhang, Sarvey, Thomas E., Yue Zhang, Zia, Muneeb, Bakir, Muhannad S.
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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Conference Proceeding
Journal Article
Combined finned microgap with dedicated extreme-microgap hotspot flow for high performance thermal management
Abbaspour, Reza, Woodrum, David C., Kottke, Peter A., Sarvey, Thomas E., Green, Craig E., Joshi, Yogendra K., Fedorov, Andrei G., Sitaraman, Suresh K., Bakir, Muhannad S.
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
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Conference Proceeding
TSVs embedded in a microfluidic heat sink: High-frequency characterization and thermal modeling
Hanju Oh, Yang Zhang, Sarvey, Thomas E., May, Gary S., Bakir, Muhannad S.
Published in 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) (01.05.2016)
Published in 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI) (01.05.2016)
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Conference Proceeding
Flow boiling of R245fa in a microgap with integrated staggered pin fins
Asrar, Pouya, Xuchen Zhang, Woodrum, Casey D., Green, Craig E., Kottke, Peter A., Sarvey, Thomas E., Sitaraman, Suresh, Fedorov, Andrei, Bakir, Muhannad, Joshi, Yogendra K.
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
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Conference Proceeding
Extreme-microgap (x-µgap) based hotspot thermal management with refrigerant flow boiling
Nasr, Mohamed H., Green, Craig E., Kottke, Peter A., Xuchen Zhang, Sarvey, Thomas E., Joshi, Yogendra K., Bakir, Muhannad S., Fedorov, Andrei G.
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
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Conference Proceeding
Design, microfabrication and thermal characterization of a hotspot cooler testbed for convective boiling experiments in extreme-microgap with integrated micropin-fins
Xuchen Zhang, Nasr, Mohamed H., Woodrum, David C., Green, Craig E., Kottke, Peter A., Sarvey, Thomas E., Joshi, Yogendra K., Sitaraman, Suresh K., Fedorov, Andrei G., Bakir, Muhannad S.
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
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Conference Proceeding
Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation
Yang Zhang, Sarvey, Thomas E., Bakir, Muhannad S.
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems
Sarvey, Thomas E., Yang Zhang, Yue Zhang, Hanju Oh, Bakir, Muhannad S.
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
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Conference Proceeding