Impact of the die attach process on power & thermal cycling for a discrete style semiconductor package
Yong Liu, Irving, S., Desbiens, D., Timwah Luk, How, N.S., YongSuk Kwon, SangDo Lee
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
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