Wafer-to-Wafer Alignment for Three-Dimensional Integration: A Review
Sang Hwui Lee, Kuan-Neng Chen, Lu, James Jian-Qiang
Published in Journal of microelectromechanical systems (01.08.2011)
Published in Journal of microelectromechanical systems (01.08.2011)
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Journal Article
Structure, Design and Process Control for Cu Bonded Interconnects in 3D Integrated Circuits
Kuan-Neng Chen, Sang Hwui Lee, Andry, P.S., Tsang, C.K., Topol, A.W., Yu-Ming Lin, Jian-Qiang Lu, Young, A.M., Meikei Ieong, Haensch, W.
Published in 2006 International Electron Devices Meeting (2006)
Published in 2006 International Electron Devices Meeting (2006)
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Conference Proceeding