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Published in Angewandte Chemie International Edition (02.01.2024)
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Nanoparticles as an antidote for poisoned gold single-atom catalysts in sustainable propylene epoxidation
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Published in Nature communications (16.04.2024)
Published in Nature communications (16.04.2024)
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Leveraging the Proximity and Distribution of Cu−Cs Sites for Direct Conversion of Methanol to Esters/Aldehydes
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Published in Angewandte Chemie (02.01.2024)
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Kinetics and mechanistic insights into the active sites of Au catalysts for selective propylene oxidation
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Published in Nano research (01.05.2023)
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Mechanistic and kinetics insights into Cu size effects on catalytic hydrogen combustion
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Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (01.04.2024)
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Total hydrogenation of hydroxymethylfurfural via hydrothermally stable Ni catalysts and the mechanistic study
Zhong, Fuzeyu, Ge, Xiaohu, Sun, Weixiao, Du, Wei, Sang, Keng, Yao, Chang, Cao, Yueqiang, Chen, Wenyao, Qian, Gang, Duan, Xuezhi, Yang, Zhirong, Zhou, Xinggui, Zhang, Jing
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (01.01.2023)
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (01.01.2023)
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Kinetics insights into size effects of carbon nanotubes’ growth and their supported platinum catalysts for 4,6-dinitroresorcinol hydrogenation
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Published in Chinese journal of chemical engineering (01.08.2024)
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Mechanistic insights into the support effects of Cu catalysts in hydrogen combustion
Zhang, Xiangxue, Fei, Nina, Sang, Keng, Chen, Wenyao, Qian, Gang, Zhang, Jing, Chen, De, Zhou, Xinggui, Duan, Xuezhi, Yuan, Weikang
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Published in Cell reports physical science (19.06.2024)
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Catalyst for preparing 1, 3-dihydroxyacetone through selective oxidation of glycerol and preparation method
SUN YIHUA, CHEN WENYAO, QIAN GANG, DUAN XUEZHI, ZHOU XINGGUI, SANG KENG, ZHANG JING
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Inspection of underfill in integrated circuit package
TAN TEK SENG, SHAKIR AHMAD ZAHRAIN B. MOHAMAD, CHA KENG SANG, FAZELAH HARIS
Year of Publication 04.03.2010
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Inspection of underfill in integrated circuit package
TAN TEK SENG, SHAKIR AHMAD ZAHRAIN B. MOHAMAD, CHA KENG SANG, FAZELAH HARIS
Year of Publication 24.11.2009
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Year of Publication 24.11.2009
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Inspection of underfill in integrated circuit package
Cha, Keng Sang, Tan, Tek Seng, Fazelah, Haris, Shakir, Ahmad Zahrain B. Mohamad
Year of Publication 24.11.2009
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Year of Publication 24.11.2009
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Methods and fixture for coupling a lid to a support substrate
Too, Seah Sun, Alcid, Edward, Juwanda, Ahmad, Cha, Keng Sang, Kam, Leang Hua, Tan, Tek Seng
Year of Publication 14.08.2007
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Year of Publication 14.08.2007
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Methods and fixture for coupling a lid to a support substrate
TOO SEAH SUN, ALCID EDWARD, TAN TEK SENG, CHA KENG SANG, KAM LEANG HUA, JUWANDA AHMAD
Year of Publication 14.08.2007
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Year of Publication 14.08.2007
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