MOLDED DIRECT CONTACT INTERCONNECT STRUCTURE WITHOUT CAPTURE PADS AND METHOD FOR THE SAME
SANDSTROM CLIFFORD, BISHOP CRAIG, DAVIS ROBIN, HOFFMAN PAUL R, OLSON TIMOTHY L
Year of Publication 07.12.2023
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Year of Publication 07.12.2023
Patent
Deca & ASE Scaling M-Series & Adaptive Patterning to 600mm
Sandstrom, Clifford, Olson, Timothy, Fang, Steve, Yang, Jeffrey
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding