by Lei, Xin, Sandborn, Peter A.
Published in Renewable energy (01.02.2018)

by Lei, Xin, A. Sandborn, Peter
Published in International journal of prognostics and health management (11.11.2020)

by Sandborn, Peter A., Prabhakar, Varun J.
Published in IEEE transactions on engineering management (01.08.2015)

by Vachtsevanos, George, Natarajan, K. A, Rajamani, Ravi, Sandborn, Peter
Year of Publication 2020

by Sandborn, Peter, Sandborn, Peter
Year of Publication 2012

by Konoza, A., Sandborn, P. A., Chaloupka, A. C.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2012)

by Chaloupka, A C, Sandborn, P A, Konoza, A
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2011)

by Bakhshi, Roozbeh, Sandborn, Peter A.
Published in IEEE transactions on sustainable energy (01.01.2018)

by Sandborn, Peter A., Wilkinson, Chris
Published in Microelectronics and reliability (01.12.2007)

by Sandborn, Peter A., Etienne, Bevin, Herrmann, Jeffrey W., Chincholkar, Mandar M.
Published in Circuit world (01.03.2004)

by Haddad, G., Sandborn, P. A., Pecht, M. G.
Published in IEEE transactions on reliability (01.12.2012)

by Feldman, K., Jazouli, T., Sandborn, P.A.
Published in IEEE transactions on reliability (01.06.2009)

by Peter Sandborn
Year of Publication 07.11.2012

by SANDBORN, Peter A, WILKINSON, Chris
Published in Microelectronics and reliability (2007)

by Murphy, Cynthia F, Abadir, Magdy S, Sandborn, Peter A
Published in Journal of electronic testing (01.02.1997)

by Sandborn, P.A., Mauro, F., Knox, R.
Published in IEEE transactions on components and packaging technologies (01.09.2007)

by Salzano, L.J., Wilkinson, C., Sandborn, P.A.
Published in IEEE transactions on advanced packaging (01.08.2005)

by Sandborn, P.A., Vertal, M.
Published in IEEE design & test of computers (01.07.1998)

by Solomon, R., Sandborn, P.A., Pecht, M.G.
Published in IEEE transactions on components and packaging technologies (01.12.2000)

by Sandborn, Peter A.
Published in IEEE transactions on components and packaging technologies (01.12.2007)