Impact of electrode surface modulation on time-dependent dielectric breakdown
Kong Boon Yeap, Tian Shen, Zhang, Galor Wenyi, Sing Fui Yap, Holt, Brian, Gondal, Arfa, Seungman Choi, San Leong Liew, Yao, Walter, Justison, Patrick
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
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Conference Proceeding
Cu seed optimization for minimum pitch wiring in 10nm and beyond
da Silva, Adam, Periasamy, Prakash, Sarad, Jeric, Mahalingam, Anbu Selvam, Liew, San Leong, Child, Craig
Published in 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.05.2016)
Published in 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.05.2016)
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Conference Proceeding
Journal Article
Extra-pattern killer defectivity improvement and enhancement of within-feature barrier coverage by optimization of TaN barrier PVD process in 90p Cu wire interconnects for 28nm technology
Rajagopalan, Balajee, Laloe, Jean-Baptiste, Silvestre, Mary Claire, Ramanathan, Eswar, Khanal, Sohana, Laval, Alain, Ge, Qian, Takahashi, Nobuyuki, Mahalingam, Anbu Selvam, Liew, San Leong, Teagle, Robert
Published in 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.05.2016)
Published in 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.05.2016)
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Conference Proceeding
Journal Article
Cool Copper Template for the Formation of Oriented Nanocrystalline α-Tantalum
Yong, Clare, Zhang, Bei Chao, Seet, Chim Seng, See, Alex, Chan, Lap, Sudijono, John, Liew, San Leong, Tung, Chih-Hang, Zeng, Hua Chun
Published in The journal of physical chemistry. B (05.12.2002)
Published in The journal of physical chemistry. B (05.12.2002)
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Journal Article
Comparison of Electromigration in Cu Interconnects with ALD or PVD TaN Liners
Hu, C.-K., Gignac, Lynne, Liniger, Eric, Grunow, Stephan, Simon, Andrew, Liew, San Leong
Published in ECS transactions (18.07.2007)
Published in ECS transactions (18.07.2007)
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Journal Article
Integration of Metallization Processes in Robust Interconnects Formation for 14 nm Nodes and beyond
Petrov, Nicolai, Law, Shao Beng, Rullan, Jonathan, Choi, Seungman, Liew, San Leong, Wah Ng, Han, Kakita, Shinichiro
Published in 2018 IEEE International Interconnect Technology Conference (IITC) (01.06.2018)
Published in 2018 IEEE International Interconnect Technology Conference (IITC) (01.06.2018)
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Conference Proceeding
Comparison of Electromigration in Cu Interconnects with ALD or PVD TaN Liners
Hu, C.-K., Gignac, Lynne, Liniger, Eric, Grunow, Stephan, Simon, Andrew, Liew, San Leong
Published in Meeting abstracts (Electrochemical Society) (30.06.2006)
Published in Meeting abstracts (Electrochemical Society) (30.06.2006)
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Journal Article
Method to form alpha phase Ta and its application to IC manufacturing
LIEW SAN LEONG, ZHANG BEI CHAO, SEET CHIM SENG, YONG LAI LIN CLARE, SUDIJONO JOHN
Year of Publication 13.11.2007
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Year of Publication 13.11.2007
Patent
Method to form alpha phase Ta and its application to IC manufacturing
Seet, Chim Seng, Zhang, Bei Chao, Liew, San Leong, Sudijono, John, Yong, Lai Lin Clare
Year of Publication 13.11.2007
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Year of Publication 13.11.2007
Patent
Entire encapsulation of Cu interconnects using self-aligned CuSiN film
Widodo, Johnny, Zhang, Bei Chao, Chen, Tong Qing, Siew, Yong Kong, Zhang, Fan, Liew, San Leong, Sudijono, John, Hsia, Liang Choo
Year of Publication 28.04.2009
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Year of Publication 28.04.2009
Patent
Entire encapsulation of Cu interconnects using self-aligned CuSiN film
LIEW SAN LEONG, ZHANG BEI CHAO, CHEN TONG QING, WIDODO JOHNNY, SUDIJONO JOHN, HSIA LIANG CHOO, SIEW YONG KONG, ZHANG FAN
Year of Publication 28.04.2009
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Year of Publication 28.04.2009
Patent
METHOD TO FORM ALPHA PHASE TA AND ITS APPLICATION TO IC MANUFACTURING
JOHN SUDIJONO, CHIM SENG SEET, BEI CHAO ZHANG, SAN LEONG LIEW, LAI LIN CLARE YONG
Year of Publication 28.10.2005
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Year of Publication 28.10.2005
Patent
Method to form alpha phase Ta and its application to IC manufacturing
LIEW SAN LEONG, ZHANG BEI CHAO, SEET CHIM SENG, CLARE YONG LAI LIN, SUDIJONO JOHN
Year of Publication 08.07.2004
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Year of Publication 08.07.2004
Patent
ENTIRE ENCAPSULATION OF CU INTERCONNECTS USING SELF-ALIGNED CUSIN FILM
LEONG LIEW SAN, CHAO ZHANG BEI, WIDODO JOHNNY, FAN ZHANG, CHOO HSIA LIANG, KONG SIEW YONG, SUDIJONO JOHN, QING CHEN TONG
Year of Publication 28.09.2007
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Year of Publication 28.09.2007
Patent