Challenges of super high thermal performance adhesive in power device application
Tan Wei Hing, Paing Samsun, Wang Hui Teng
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
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Conference Proceeding
Die Pad Delamination on QFN Package
Chiew, Chong Chee, Samsun, Paing, Vigneswaran, Letcheemana, Ang, Amy
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)
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Conference Proceeding
Subtractive Metal Structuring on Surface of Semiconductor Package
Lee, Chee Hong, Pok, Pei Luan, Lee, Swee Kah, Chong, Chee Chiew, Paing, Samsun, Goh, Soon Lock
Year of Publication 19.09.2024
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Year of Publication 19.09.2024
Patent
Subtraktives Metallstrukturieren auf der Oberfläche eines Halbleiterpackages
Lee, Chee Hong, Pok, Pei Luan, Lee, Swee Kah, Chong, Chee Chiew, Paing, Samsun, Goh, Soon Lock
Year of Publication 19.09.2024
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Year of Publication 19.09.2024
Patent