Reduced electromigration and stressed induced migration of copper wires by surface coating
Hu, Chao-Kun, Rosenberg, Robert, Rubino, Judith M, Sambucetti, Carlos J, Stamper, Anthony K
Year of Publication 23.12.2008
Get full text
Year of Publication 23.12.2008
Patent
Reduced electromigration and stressed induced migration of copper wires by surface coating
STAMPER ANTHONY K, HU CHAO-KUN, SAMBUCETTI CARLOS J, RUBINO JUDITH M, ROSENBERG ROBERT
Year of Publication 23.12.2008
Get full text
Year of Publication 23.12.2008
Patent
Self-aligned corrosion stop for copper C4 and wirebond
STAMPER ANTHONY K, SAMBUCETTI CARLOS J, RUBINO JUDITH M, EDELSTEIN DANIEL C
Year of Publication 25.07.2006
Get full text
Year of Publication 25.07.2006
Patent
Self-aligned corrosion stop for copper C4 and wirebond
Edelstein, Daniel C, Stamper, Anthony K, Rubino, Judith M, Sambucetti, Carlos J
Year of Publication 25.07.2006
Get full text
Year of Publication 25.07.2006
Patent
Means of seeding and metallizing polyimide
Doany, Fuad E, Marino, Jeffrey R, Sambucetti, Carlos J, Saraf, Ravi F
Year of Publication 25.04.2006
Get full text
Year of Publication 25.04.2006
Patent
Reduced electromigration and stressed induced migration of copper wires by surface coating
STAMPER ANTHONY K, HU CHAO-KUN, SAMBUCETTI CARLOS J, RUBINO JUDITH M, ROSENBERG ROBERT
Year of Publication 01.12.2005
Get full text
Year of Publication 01.12.2005
Patent
METHOD FOR PREPARING A CONDUCTIVE PAD FOR ELECTRICAL CONNECTION AND CONDUCTIVE PAD FORMED
JOHN G. GAUDIELLO, JUDITH M. RUBINO, DANIEL C. EDELSTEIN, CARLOS J. SAMBUCETTI, GEORGE WALKER
Year of Publication 29.07.2005
Get full text
Year of Publication 29.07.2005
Patent
Self-aligned corrosion stop for copper C4 and wirebond
STAMPER ANTHONY K, SAMBUCETTI CARLOS J, RUBINO JUDITH M, EDELSTEIN DANIEL C
Year of Publication 25.11.2004
Get full text
Year of Publication 25.11.2004
Patent
Self-aligned corrosion stop for copper C4 and wirebond
Edelstein, Daniel C, Stamper, Anthony K, Rubino, Judith M, Sambucetti, Carlos J
Year of Publication 24.08.2004
Get full text
Year of Publication 24.08.2004
Patent
Self-aligned corrosion stop for copper C4 and wirebond
STAMPER ANTHONY K, SAMBUCETTI CARLOS J, RUBINO JUDITH M, EDELSTEIN DANIEL C
Year of Publication 24.08.2004
Get full text
Year of Publication 24.08.2004
Patent
Method for preparing a conductive pad for electrical connection and conductive pad formed
JOHN G GAUDIELLO, JUDITH M RUBINO, CARLOS J SAMBUCETTI, DANIEL C EDELSTEIN, GEORGE WALKER
Year of Publication 11.08.2004
Get full text
Year of Publication 11.08.2004
Patent
Ball Limiting Metallurgy, Interconnection Structure Including the Same, and Method of Forming an Interconnection Structure
HENDERSON DONALD W, NYE HENRY A.III, KANG SUNG-KWON, KILPATRICK STEPHEN J, SAMBUCETTI CARLOS J, CHIRAS STEFANIE R, SHIH DA-YUAN, CHENG YU-TING
Year of Publication 10.01.2008
Get full text
Year of Publication 10.01.2008
Patent
Method for testing chips on flat solder bumps
GRUBER PETER A, SAMBUCETTI CARLOS J, DATTA MADHAV, RUBINO JUDITH M, WALKER GEORGE F
Year of Publication 06.05.2004
Get full text
Year of Publication 06.05.2004
Patent
Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure
Cheng, Yu-Ting, Chiras, Stefanie Ruth, Henderson, Donald W, Kang, Sung-Kwon, Kilpatrick, Stephen James, Nye, III, Henry A, Sambucetti, Carlos J, Shih, Da-Yuan
Year of Publication 25.09.2007
Get full text
Year of Publication 25.09.2007
Patent