Empirical modeling and response surfaces for electroless Co deposition process
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Published in Journal of the Electrochemical Society (01.05.1995)
Published in Journal of the Electrochemical Society (01.05.1995)
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Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer
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Reduced electromigration and stressed induced migration of copper wires by surface coating
Hu, Chao-Kun, Rosenberg, Robert, Rubino, Judith M, Sambucetti, Carlos J, Stamper, Anthony K
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Year of Publication 23.12.2008
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Reduced electromigration and stressed induced migration of copper wires by surface coating
STAMPER ANTHONY K, HU CHAO-KUN, SAMBUCETTI CARLOS J, RUBINO JUDITH M, ROSENBERG ROBERT
Year of Publication 23.12.2008
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Year of Publication 23.12.2008
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Self-aligned corrosion stop for copper C4 and wirebond
Edelstein, Daniel, Stamper, Anthony, Rubino, Judith, Sambucetti, Carlos
Year of Publication 25.11.2004
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Year of Publication 25.11.2004
Patent
Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures
CHIRAS STEFANIE RUTH, ROSENBERG ROBERT, LANE MICHAEL WAYNE, MC FEELY FENTON REED, SAMBUCETTI CARLOS JUAN, MALHOTRA SANDRA GUY, VEREECKEN PHILIPPE MARK
Year of Publication 02.11.2010
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Year of Publication 02.11.2010
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Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures
Chiras, Stefanie Ruth, Lane, Michael Wayne, Malhotra, Sandra Guy, Mc Feely, Fenton Reed, Rosenberg, Robert, Sambucetti, Carlos Juan, Vereecken, Philippe Mark
Year of Publication 02.11.2010
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Year of Publication 02.11.2010
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Method for testing chips on flat solder bumps
Gruber, Peter, Datta, Madhav, Rubino, Judith, Sambucetti, Carlos, Walker, George
Year of Publication 06.05.2004
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Year of Publication 06.05.2004
Patent
Self-aligned corrosion stop for copper C4 and wirebond
Edelstein, Daniel, Stamper, Anthony, Rubino, Judith, Sambucetti, Carlos
Year of Publication 17.04.2003
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Year of Publication 17.04.2003
Patent
Self-aligned corrosion stop for copper C4 and wirebond
STAMPER ANTHONY K, SAMBUCETTI CARLOS J, RUBINO JUDITH M, EDELSTEIN DANIEL C
Year of Publication 25.07.2006
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Year of Publication 25.07.2006
Patent