Search Results - "Salama, Islam A" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

$Dynamic two-dimensional refractive index modulation for high performance acousto-optic deflector$

Dynamic two-dimensional refractive index modulation for high performance acousto-optic deflector

by Wang, Tiansi, Zhang, Chong, Aleksov, Aleksandar, Salama, Islam A, Kar, Aravinda
Published in Optics express (28.12.2015)

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Journal Article

레이저 빔 조향용 음향 광학 편향기 및 거울

레이저 빔 조향용 음향 광학 편향기 및 거울

by SALAMA ISLAM A, ZHANG CHONG
Year of Publication 13.11.2017

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Patent

SUBSTRATE PATCH RECONSTITUTION OPTIONS

SUBSTRATE PATCH RECONSTITUTION OPTIONS

by ALUR AMRUTHAVALLI P, JEN WEI LUN K, SALAMA ISLAM A, HARIRI HAIFA
Year of Publication 22.09.2020

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Patent

리세스를 갖는 인터포저를 포함하는 집적 회로 구조물

리세스를 갖는 인터포저를 포함하는 집적 회로 구조물

by SALAMA ISLAM A, LEE KYU OH
Year of Publication 27.02.2018

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Patent

Determination of Thermophysical Properties for Polymer Films using Conduction Analysis of Laser Heating

Determination of Thermophysical Properties for Polymer Films using Conduction Analysis of Laser Heating

by Zhang, Chong, Salama, Islam A., Quick, Nathaniel R., Kar, Aravinda
Published in International journal of thermophysics (01.06.2007)

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Journal Article

패키지 온 패키지를 위한 리세싱된 전도성 컨택들을 갖는 집적 회로 구조체들

패키지 온 패키지를 위한 리세싱된 전도성 컨택들을 갖는 집적 회로 구조체들

by SABI BABAK, SALAMA ISLAM A, LEE KYU OH, CHAVALI SRI CHAITRA JYOTSNA, VISWANATH RAM S, SANKMAN ROBERT L
Year of Publication 27.02.2018

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Patent

ACOUSTO-OPTIC DEFLECTOR WITH MULTIPLE TRANSDUCERS FOR OPTICAL BEAM STEERING

ACOUSTO-OPTIC DEFLECTOR WITH MULTIPLE TRANSDUCERS FOR OPTICAL BEAM STEERING

by ALEKSOV ALEKSANDAR, SALAMA ISLAM A, WANG TIANSI, ZHANG CHONG, KAR ARAVINDA
Year of Publication 23.11.2016

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Patent

센서 통합 패키지 제조 방법 및 이로부터 형성된 구조물

센서 통합 패키지 제조 방법 및 이로부터 형성된 구조물

by SOTO GONZALEZ JAVIER, KONG LAY WAI, SALAMA ISLAM A, LEE KYU OH, ZHOU ZHENG, OSTER SASHA N, EID FERAS
Year of Publication 29.11.2017

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Patent

HYBRID-CORE THROUGH HOLES AND VIAS

HYBRID-CORE THROUGH HOLES AND VIAS

by ROY MIHIR K, LI YONGGANG, SALAMA ISLAM A
Year of Publication 25.07.2013

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Patent

THROUGH MOLD VIA POLYMER BLOCK PACKAGE

THROUGH MOLD VIA POLYMER BLOCK PACKAGE

by ROY MIHIR K, GURUMURTHY CHARAVANA K, SALAMA ISLAM A, SANKMAN ROBERT L
Year of Publication 05.09.2012

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Patent

One-dimensional transient analysis of volumetric heating for laser drilling

One-dimensional transient analysis of volumetric heating for laser drilling

by Zhang, Chong, Salama, Islam A., Quick, Nathaniel R., Kar, Aravinda
Published in Journal of applied physics (01.06.2006)

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Journal Article

DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE

DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE

by SALAMA, Islam A, JEN, Wei-Lun Kane, MAY, Robert Alan, DARMAWIKARTA, Kristof, ROSCH, Jonathan L
Year of Publication 01.08.2024

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Patent

Device and method of very high density routing used with embedded multi-die interconnect bridge

Device and method of very high density routing used with embedded multi-die interconnect bridge

by Salama, Islam A, May, Robert Alan, Darmawikarta, Kristof, Jen, Wei-Lun Kane, Rosch, Jonathan L
Year of Publication 16.07.2024

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Patent

Acousto-optics deflector and mirror for laser beam steering

Acousto-optics deflector and mirror for laser beam steering

by Salama, Islam A, Zhang, Chong
Year of Publication 14.05.2019

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Patent

Device and method of very high density routing used with embedded multi-die interconnect bridge

Device and method of very high density routing used with embedded multi-die interconnect bridge

by Salama, Islam A, May, Robert Alan, Darmawikarta, Kristof, Jen, Wei-Lun Kane, Rosch, Jonathan L
Year of Publication 18.06.2024

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Patent

Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same

Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same

by Salama, Islam A, Alur, Amruthavalli Pallavi, May, Robert Alan, Sankman, Robert L, Boyapati, Sri Ranga Sai
Year of Publication 19.09.2023

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Patent

METHOD OF PROVIDING A PRINTED CIRCUIT BOARD USING LASER ASSISTED METALLIZATION AND PATTERNING OF A MICROELECTRONIC SUBSTRATE

METHOD OF PROVIDING A PRINTED CIRCUIT BOARD USING LASER ASSISTED METALLIZATION AND PATTERNING OF A MICROELECTRONIC SUBSTRATE

by Salama Islam A
Year of Publication 13.10.2016

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Patent

Microelectronic device with embedded die substrate on interposer

Microelectronic device with embedded die substrate on interposer

by Salama, Islam A, Alur, Amruthavalli Pallavi, May, Robert Alan, Li, Sheng, Darmawikarta, Kristof, Sankman, Robert L, Boyapati, Sri Ranga Sai
Year of Publication 23.07.2024

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Patent

DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE

DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE

by SALAMA, Islam A, JEN, Wei-Lun Kane, MAY, Robert Alan, DARMAWIKARTA, Kristof, ROSCH, Jonathan L
Year of Publication 04.05.2023

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Patent

Microelectronic device with embedded die substrate on interposer

Microelectronic device with embedded die substrate on interposer

by Salama, Islam A, Alur, Amruthavalli Pallavi, May, Robert Alan, Li, Sheng, Darmawikarta, Kristof, Sankman, Robert L, Boyapati, Sri Ranga Sai
Year of Publication 06.02.2024

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Patent

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