Nanoindentation based method to determine the thermal expansion coefficients of low-k dielectrics
Vanstreels, Kris, Salahouelhadj, Abdellah, Gonzalez, Mario
Published in Thin solid films (01.10.2022)
Published in Thin solid films (01.10.2022)
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Journal Article
Process Challenges During CVD Oxide Deposition on the Backside of 20-\mu m Thin 300-mm Wafers Temporarily Bonded to Glass Carriers
Kennes, Koen, Guerrero, Alice, Salahouelhadj, Abdellah, Suhard, Samuel, Derakhshandeh, Jaber, Phommahaxay, Alain, Brems, Steven, Beyer, Gerald, Beyne, Eric
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
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Conference Proceeding
Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding
Tsau, Yan Wen, De Messemaeker, Joke, Salahouelhadj, Abdellah, Gonzalez, Mario, Witters, Liesbeth, Zhang, Boyao, Seefeldt, Marc, Beyne, Eric, De Wolf, Ingrid
Published in Microelectronics and reliability (01.11.2022)
Published in Microelectronics and reliability (01.11.2022)
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Journal Article
Modeling of the cyclic behavior of elastic–viscoplastic composites by the additive tangent Mori–Tanaka approach and validation by finite element calculations
Czarnota, C., Kowalczyk-Gajewska, K., Salahouelhadj, A., Martiny, M., Mercier, S.
Published in International journal of solids and structures (15.03.2015)
Published in International journal of solids and structures (15.03.2015)
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Journal Article
Application of the continuum shell finite element SHB8PS to sheet forming simulation using an extended large strain anisotropic elastic–plastic formulation
Salahouelhadj, A., Abed-Meraim, F., Chalal, H., Balan, T.
Published in Archive of applied mechanics (1991) (01.09.2012)
Published in Archive of applied mechanics (1991) (01.09.2012)
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Journal Article
Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up
Podpod, Arnita, Phommahaxay, Alain, Bex, Pieter, Slabbekoorn, John, Bertheau, Julien, Salahoueldhadj, Abdellah, Sleeckx, Erik, Miller, Andy, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Yess, Kim, Arnold, Kim
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-µm Pitch
Podpod, Arnita, Slabbekoorn, John, Phommahaxay, Alain, Duval, Fabrice, Salahouelhadj, Abdellah, Gonzalez, Mario, Rebibis, Kenneth, Miller, Andy, Beyer, Gerald, Beyne, Eric
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Thermal characterization of the inter-die thermal resistance of hybrid Cu/dielectric wafer-to-wafer bonding
Oprins, Herman, Cherman, Vladimir, Webers, Tomas, Salahouelhadj, Abdellah, Soon-Wook Kim, Lan Peng, Van der Plas, Geert, Beyne, Eric
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
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Conference Proceeding
Low Warpage Wafer Level Transfer Molding Post 3D Die to Wafer Assembly
Cadacio, Francisco, Wang, Teng, Salahouelhadj, Abdellah, Capuz, Giovanni, Potoms, Goedele, Rebibis, Kenneth June, Beyer, Gerald, Beyne, Eric, Gal, Wilfred, Zijl, Jurrian, Kersjes, Sebastiaan, Wensink, Henk
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges
De Vos, Joeri, Cherman, Vladimir, Detalle, Mikael, Teng Wang, Salahouelhadj, Abdellah, Daily, Robert, Van der Plas, Geert, Beyne, Eric
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
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Conference Proceeding
An alternative 3D packaging route through wafer reconstruction
Cadacio, Francisco, Teng Wang, Salahouelhadj, Abdellah, Capuz, Giovanni, Gerets, Carine, Potoms, Goedele, Verwoerdt, Rudy, Rebibis, Kenneth June, Beyer, Gerald, Miller, Andy, Beyne, Eric, Brouwer, Erik
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding