by Sakuma, Katsuyuki, Abrami, Avner, Blumrosen, Gaddi, Lukashov, Stanislav, Narayanan, Rajeev, Ligman, Joseph W, Caggiano, Vittorio, Heisig, Stephen J
Published in Scientific reports (21.12.2018)

by Blumrosen, Gaddi, Sakuma, Katsuyuki, Rice, John Jeremy, Knickerbocker, John
Published in IEEE access (2020)

by Unami, Naoko, Sakuma, Katsuyuki, Mizuno, Jun, Shoji, Shuichi
Published in Japanese Journal of Applied Physics (01.06.2010)

by Matsumoto, Keiji, Ibaraki, Soichiro, Sueoka, Kuniaki, Sakuma, Katsuyuki, Kikuchi, Hidekazu, Orii, Yasumitsu, Yamada, Fumiaki
Published in 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2011)

by Raghavan, Sathya, Mori, Hiroyuki, Bonilla, Griselda, Sakuma, Katsuyuki
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)

by Matsumoto, Keiji, Ibaraki, Soichiro, Sato, Masaaki, Sakuma, Katsuyuki, Orii, Yasumitsu, Yamada, Fumiaki
Published in 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.02.2010)

by Matsumoto, K., Ibaraki, S., Sueoka, K., Sakuma, K., Kikuchi, H., Orii, Y., Yamada, F.
Published in 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.03.2012)

by Takuji Matsumoto, Takuji Matsumoto, Masakazu Satoh, Masakazu Satoh, Katsuyuki Sakuma, Katsuyuki Sakuma, Hiroyuki Kurino, Hiroyuki Kurino, Nobuaki Miyakawa, Nobuaki Miyakawa, Hikotaro Itani, Hikotaro Itani, Mitsumasa Koyanagi, Mitsumasa Koyanagi
Published in Japanese Journal of Applied Physics (01.03.1998)

by Sakuma, K, Mizuno, J, Nagai, N, Unami, N, Shoji, S
Published in IEEE transactions on electronics packaging manufacturing (01.07.2010)

by SAKUMA KATSUYUKI, MUKTA GHATE FAROOQ
Year of Publication 21.04.2023

by Chen, Qianwen, Belyansky, Michael, Sulehria, Yasir, Horibe, Akihiro, Qin, Liqiao, Pujari, Ruturaj, Perfecto, Eric, Lie, Fee Li, Butt, Shahid, Polomoff, Nick, Miyazawa, Risa, Kohara, Sayuri, Farooq, Mukta, Hisada, Takashi, Oakley, Jennifer, Skordas, Spyridon, Fan, Susan, Sakuma, Katsuyuki, Knickerbocker, John, Mcherron, Dale, Tamura, Takeshi, Ishii, Takayuki, Jaipan, Panupong, Nishimura, Satoshi, Son, Ilseok, Maeda, Yohei, Koga, Takashi, Klein, Joseph, Tashiro, Kei, Arkalgud, Sitaram, Kondo, Yoshihiro
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)

by Sakuma, Katsuyuki, Tunga, Krishna, Webb, Buck, Ramachandran, Koushik, Interrante, Marcus, Hsichang Liu, Angyal, Matthew, Berger, Daniel, Knickerbocker, John, Iyer, Subramanian
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)

by SAKUMA KATSUYUKI
Year of Publication 06.08.2015

by SAKUMA KATSUYUKI, TUNGA KRISHNA, LI SHIDONG, BONILLA GRISELDA
Year of Publication 04.04.2023

by Sakuma, Katsuyuki, Farooq, Mukta, Andry, Paul, Cabral, Cyril, Wassick, Thomas, McHerron, Dale, Divakaruni, Rama
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2021)

by HEISIG STEPHEN JOHN, STELLITANO MICHAEL ANGELO, SAKUMA KATSUYUKI
Year of Publication 22.08.2022

by Kurino, Hiroyuki, Lee, Kang Wook, Sakuma, Katsuyuki, Nakamura, Tomonori, Koyanagi, Mitsumasa
Published in Japanese Journal of Applied Physics (01.04.1999)

by Wook Lee, Kang, Tae Park, Tomonori Nakamura, Yoon Kim, Hiroaki Shimazutsu, Hiroyuki Kurino, Hiroyuki Kurino, Mitsumasa Koyanagi, Mitsumasa Koyanagi
Published in Japanese Journal of Applied Physics (2000)

by Knickerbocker, J U, Andry, P S, Dang, B, Horton, R R, Interrante, M J, Patel, C S, Polastre, R J, Sakuma, K, Sirdeshmukh, R, Sprogis, E J, Sri-Jayantha, S M, Stephens, A M, Topol, A W, Tsang, C K, Webb, B C, Wright, S L
Published in IBM journal of research and development (01.11.2008)

by 水野, 潤, 佐久間, 克幸, 宇波, 奈保子, 仁村, 将次, 庄子, 習一
Published in スマートプロセス学会誌 (20.05.2012)