Effects of Solder Mask Application Method on The Reliability of An Automotive Flip Chip PBGA Microcontroller
Nazmus Sakib, A R, Lai, Richard S, Shantaram, Sandeep
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
Get full text
Conference Proceeding
Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability
Kelly, Marion Branch, Maity, Tapabrata, Nazmus Sakib, A. R., Frear, D. R., Chawla, Nikhilesh
Published in Journal of electronic materials (01.05.2020)
Published in Journal of electronic materials (01.05.2020)
Get full text
Journal Article
Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability
Kelly, Marion Branch, Maity, Tapabrata, Nazmus Sakib, A. R., Frear, D. R., Chawla, Nikhilesh
Published in Journal of electronic materials (01.07.2020)
Published in Journal of electronic materials (01.07.2020)
Get full text
Journal Article
Shear fracture of confined NaCl nanofilms
Sakib, A.R. Nazmus, De, Narendra N., Adnan, Ashfaq
Published in Computational materials science (01.02.2013)
Published in Computational materials science (01.02.2013)
Get full text
Journal Article
Effect of removal of layers of WCSP assembly under thermal cyclic loading: A computational approach
Barua, Trina, Mahmood, Anik, Rajashekar, Karthik, Sabne, Sayalee, Nazmus Sakib, A. R., Agonafer, Dereje
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
Get full text
Conference Proceeding
A computational study of PCB layer orientation of WCSP assembly under temperature dependent drop impact loading
Mahmood, Anik, Barua, Trina, Sabne, Saylalee, Nazmus Sakib, A. R., Agonafer, Dereje
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
Get full text
Conference Proceeding
Impact of chip-package parameters on the thermomechanical reliability of high thermal die attach materials in RF, power, and automotive applications
Sakib, A R Nazmus, Ricon, Ruther, Eom, Jake, Kawashima, Yoshitsugu, Azuma, Kosuke, Tharumalingam, Ganesh, Kim, Young
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding
Impact of PCB Layer Orientation on the Drop Reliability of WCSP Boards
Mahmood, Anik, Barua, Trina, Nazmus Sakib, A. R., Agonafer, Dereje
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Get full text
Conference Proceeding
Fatigue and Shear Properties of Novel Lead-free Solder Joints with Low Melting Temperatures
Wei, Xin, El Amine Belhadi, Mohamed, Vyas, Palash Pranav, Sakib, A R Nazmus, Hamasha, Sa'd, Ali, Haneen
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Get full text
Conference Proceeding
Reaction Kinetics and Rheological Model Coefficient Extraction for Epoxy Mold Compounds
Sakib, A R Nazmus, Jha, Vibhash, Mavinkurve, Amar, Chopin, Sheila
Published in 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2018)
Published in 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2018)
Get full text
Conference Proceeding
Coupled Thermal and Thermo-Mechanical Simulation for Flip-chip Component Level Copper Pillar Bump Fatigue
Shantaram, Sandeep, Sakib, A R Nazmus, Lakhera, Nishant
Published in 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2018)
Published in 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2018)
Get full text
Conference Proceeding
Comparison of the effect of elastic and viscoelastic modeling of PCBs on the assessment of board level reliability
Misrak, Abel, Anaskure, Avinash, Sakib, A R Nazmus, Rahangdale, Unique, Lohia, Alok, Agonafer, Dereje
Published in 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2017)
Published in 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2017)
Get full text
Conference Proceeding
Impact of replacing Sn-Ag bumps with Cu pillars on the BEoL Cu/Low-k fracture under reflow - a computational study
Baig, Zaeem, Shetty, Tejas S., Nazmus Sakib, A. R., Mirza, Fahad, Agonafer, Dereje
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
Get full text
Conference Proceeding