Advanced 3D integration TSV and flip chip technologies evaluation for the packaging of a mobile LiDAR 256 channels beam steering device designed for autonomous driving application
Mourier, Thierry, Berchet, Nadia Miloud-Ali, Auffret, Juliette, Raphoz, Natacha, Sahouane, Yacoub, Patrice, Damien Saint, Deschaseaux, Edouard, Peray, Patrick, Guerber, Sylvain, Simoens, Francois
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Technological and Electrical Performances of Ultrafine-Pitch Flip-Chip Assembly Based on Room-Temperature Vertical Interconnection
Fendler, M, Marion, F, Saint Patrice, Damien, Mandrillon, V, Berger, F, Ribot, H
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)
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Journal Article
RF Power-Handling Performance for Direct Actuation of Germanium Telluride Switches
Leon, Alexandre, Reig, Bruno, Perret, Etienne, Podevin, Florence, Saint-Patrice, Damien, Puyal, Vincent, Lugo-Alvarez, Jose, Ferrari, Philippe
Published in IEEE transactions on microwave theory and techniques (01.01.2020)
Published in IEEE transactions on microwave theory and techniques (01.01.2020)
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Journal Article
METHOD FOR PACKAGING A MICROELECTRONIC DEVICE IN A HERMETICALLY SEALED CAVITY AND MANAGING THE ATMOSPHERE OF THE CAVITY WITH A DEDICATED HOLE
REIG BRUNO, PORNIN JEAN LOUIS, GRECO FLORENT, HENN GUDRUN, SAINT PATRICE DAMIEN, DEN DEKKER ARNOLDUS, GIESEN MARCEL
Year of Publication 09.08.2016
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Year of Publication 09.08.2016
Patent
RF Power-Handling Performance for Direct Actuation of GeTe Switches
Leon, Alexandre, Reig, Bruno, Perret, Etienne, Podevin, Florence, Saint-Patrice, Damien, Puyal, Vincent, Lugo-Alvarez, Jose, Ferrari, Philippe
Published in IEEE transactions on microwave theory and techniques (31.10.2019)
Published in IEEE transactions on microwave theory and techniques (31.10.2019)
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Journal Article
POPSTAR: a Robust Modular Optical NoC Architecture for Chiplet-based 3D Integrated Systems
Thonnart, Yvain, Bernabe, Stephane, Charbonnier, Jean, Bernard, Christian, Coriat, David, Fuguet, Cesar, Tissier, Pierre, Charbonnier, Benoit, Malhouitre, Stephane, Saint-Patrice, Damien, Assous, Myriam, Narayan, Aditya, Coskun, Ayse, Dutoit, D., Vivet, P.
Published in 2020 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01.03.2020)
Published in 2020 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01.03.2020)
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Conference Proceeding
Varifocal liquid lenses with integrated actuator, high focusing power and low operating voltage fabricated on 200 mm wafers
Pouydebasque, Arnaud, Bridoux, Claudine, Jacquet, Fabrice, Moreau, Stephane, Sage, Eric, Saint-Patrice, Damien, Bouvier, Christophe, Kopp, Christophe, Marchand, Gilles, Bolis, Sebastien, Sillon, Nicolas, Vigier-Blanc, Emmanuelle
Published in Sensors and actuators. A. Physical. (01.12.2011)
Published in Sensors and actuators. A. Physical. (01.12.2011)
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Journal Article
Varifocal liquid lenses with integrated actuator, high focusing power and low operating voltage fabricated on 200mm wafers
Pouydebasque, Arnaud, Bridoux, Claudine, Jacquet, Fabrice, Moreau, Stéphane, Sage, Eric, Saint-Patrice, Damien, Bouvier, Christophe, Kopp, Christophe, Marchand, Gilles, Bolis, Sébastien, Sillon, Nicolas, Vigier-Blanc, Emmanuelle
Published in Sensors and actuators. A. Physical. (01.12.2011)
Published in Sensors and actuators. A. Physical. (01.12.2011)
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Journal Article
Comparative Life Cycle Analysis of Redistribution Layer for 3D Integrations
Guillou, Suzanne, Saint-Patrice, Damien, Vauche, Laura, Castagne, Laetitia, Moreau, Stephane, Velard, Remi, Di Cioccio, Lea
Published in 2024 Electronics Goes Green 2024+ (EGG) (18.06.2024)
Published in 2024 Electronics Goes Green 2024+ (EGG) (18.06.2024)
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Conference Proceeding
Aging Behaviour and Environmental Impact of Under Bump Metallurgies for Wafer Level Balling
Garnier, Arnaud, Castagne, Laetitia, Moreau, Stephane, Fraczkiewicz, Alexandra, Monniez, Theo, Mermin, Daniel, Guillou, Suzanne, Vauche, Laura, Saint-Patrice, Damien, Coudrain, Perceval
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding