Direct bonding for wafer level 3D integration
Di Cioccio, Lea, Radu, Ionut, Gueguen, Pierric, Sadaka, Mariam
Published in 2010 IEEE International Conference on Integrated Circuit Design and Technology (01.06.2010)
Published in 2010 IEEE International Conference on Integrated Circuit Design and Technology (01.06.2010)
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Conference Proceeding
3D integration: Advantages, enabling technologies & applications
Sadaka, Mariam, Radu, Ionut, Di Cioccio, Lea
Published in 2010 IEEE International Conference on Integrated Circuit Design and Technology (01.06.2010)
Published in 2010 IEEE International Conference on Integrated Circuit Design and Technology (01.06.2010)
Get full text
Conference Proceeding