Electrophotobiomodulation in the treatment of facial post-burn hypertrophic scars in pediatric patients
Elmelegy, N G, Hegazy, A M, Sadaka, M S, Abdeldaim, D E
Published in Annals of burns and fire disasters (30.06.2018)
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Published in Annals of burns and fire disasters (30.06.2018)
Journal Article
Nourin miRNAs: novel biomarkers highly expressed in unstable angina patients with normal ECG and negative hs-troponin and dropped post percutaneous coronary intervention
Kandil, H I, Yacoub, B, Sadaka, M, Yehia, A, El-Khazragy, N, Rashed, L, El-Hadidi, A S, Kreutzer, D L, Christenson, R H, Elgebaly, S A
Published in European heart journal (09.11.2023)
Published in European heart journal (09.11.2023)
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Journal Article
The prediction of angiographic coronary thrombus burden using the admission GRACE 2.0 score in ST-elevation myocardial infarction patients
Elkammash, A, Abdelhamid, M, Sobhy, M, Zaki, A, Sadaka, M
Published in European heart journal. Acute cardiovascular care (03.05.2023)
Published in European heart journal. Acute cardiovascular care (03.05.2023)
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Journal Article
Molecular and serological techniques for the diagnosis of culture negative infective endocarditis in Alexandria Main University Hospital
Sadaka, Salama M., El-Ghazzawy, Iman F., Hassanen, Mahmoud M., Abu El Kasem, Ahmed S., Nour El Din, Amina M., Meheissen, Marwa A.
Published in The Egyptian heart journal (01.09.2013)
Published in The Egyptian heart journal (01.09.2013)
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Journal Article
Admission heart failure and coronary perfusion in ST-elevation myocardial infarction patients undergoing primary percutaneous coronary intervention
Elkammash, A, Abdelhamid, M, Sobhy, M, Zaki, A, Sadaka, M, Omoniyi, O, Alsinan, M, Farahat, R, Al Sattouf, A, Abbas, A, Madi, K
Published in European heart journal. Acute cardiovascular care (03.05.2023)
Published in European heart journal. Acute cardiovascular care (03.05.2023)
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Journal Article
Recent developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking
Radu, I, Landru, D, Gaudin, G, Riou, G, Tempesta, C, Letertre, F, Di Cioccio, L, Gueguen, P, Signamarcheix, T, Euvrard, C, Dechamp, J, Clavelier, L, Sadaka, M
Published in 2010 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2010)
Published in 2010 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2010)
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Conference Proceeding
Smart stackingTM technology: An industrial solution for 3D layer stacking
Blanchard, C L, Radu, I, Sadaka, M, Landry, K
Published in 2011 IEEE International Conference on IC Design & Technology (01.05.2011)
Published in 2011 IEEE International Conference on IC Design & Technology (01.05.2011)
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Conference Proceeding
Dual-band multi-mode power amplifier module using a third generation HBT technology
Savary, P., Girardot, A., Montoriol, G., Dupis, F., Thibaud, B., Jaoui, R., Chapoux, L., Esnault, V., Cornibert, L., Izumi, O., Hill, D., Sadaka, M., Henry, H., Yu, E., Tutt, M., Majerus, M., Uscola, R., Clayton, F., Rampley, C., Klingbeil, S., Rajagopalan, K., Mitra, A., Reyes, A.
Published in GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191) (2001)
Published in GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191) (2001)
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Conference Proceeding
Integration challenges of new materials and device architectures for IC applications
Bich-Yen Nguyen, Thean, A., White, T., Vandooren, A., Sadaka, M., Mathew, L., Barr, A., Thomas, S., Zalava, M., Da Zhang, Eades, D., Zhong-Hai Shi, Schaeffer, J., Triyoso, D., Samavedam, S., Vartanian, V., Stephen, T., Goolsby, B., Zollner, S., Liu, R., Noble, R., Thien Nguyen, Dhandapani, V., Xie, B., Xang-Dong Wang, Jiang, J., Rai, R., Sadd, M., Ramon, M., Kalpat, S., Prabhu, L., Kaushik, V., Du, Y., Dao, T., Mendicino, M., Orlowski, M., Tobin, P., Mogab, J., Venkatesan, S.
Published in 2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866) (2004)
Published in 2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866) (2004)
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Conference Proceeding