Parametric study of the QFN mounted PCB- Cu layer thickness effect on the stress induced during drop testing
Sabne, Sayalee, Mahmood, Anik, Barua, Trina, Agonafer, Dereje, Kansara, Nachiket
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
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Conference Proceeding
High-temperature Pb-free die attach material project phase 1: Survey result
Pei, Lim Sze, Pan, Binghua, Zhang, Hongwen, Ng, Wayne, Wu, Bosgum, Siow, Kim S., Sabne, Sayalee, Tsuriya, Masahiro
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
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Conference Proceeding
Effect of removal of layers of WCSP assembly under thermal cyclic loading: A computational approach
Barua, Trina, Mahmood, Anik, Rajashekar, Karthik, Sabne, Sayalee, Nazmus Sakib, A. R., Agonafer, Dereje
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)
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Conference Proceeding