by Dandong Ge, Che, F. X., Yik Siong Tay, Swee Lee Gan, Yazid, M.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)

by Wang Mei Yong, Teo, J., Gan Swee Lee, Tan Kian Heong, Swee, A.
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)

by Che, F. X., Dandong Ge, Yik Siong Tay, Yazid, M., Swee Lee Gan
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)

by Dandong Ge, Harald, P, Gan Swee Lee, Koh, L K I
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)

by Tian, Yujia, Kripalani, Devesh, Xue, Ming, Gan, Swee Lee, Zhou, Kun
Published in 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (15.07.2024)

by Ge, Dandong, Subramanian, N. R., Yong, Khai Seen, Foo, Mun Yee, Gan, Swee Lee
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)

by Sugianto, Yusman, Swee Lee, Gan, Chyeo Yong, Tay, Tan, Wee Kuan, Hudda, Murad, Hiew, Fu San, Yussuff, Arieff Ridzwan, Tan, Siao Kiat, Xiaojun, Wang, Dandong, Ge, Chow York, Lee
Year of Publication 05.02.2019

by TAN Wee Kuan, HIEW Fu San, TAN Siao Kiat, YUSSUFF Arieff Ridzwan, CHYEO YONG Tay, SUGIANTO Yusman, CHOW YORK Lee, SWEE LEE Gan, DANDONG Ge, HUDDA Murad, XIAOJUN Wang
Year of Publication 22.06.2017

by Sugianto, Yusman, Gan, Swee Lee, Hudda, Murad, Tan, Wee Kuan, Hiew, Fu San, Yussuff, Arieff Ridzwan, Lee, Chow York, Tan, Siao Kiat, Ge, Dandong, Wang, Xiaojun, Tay, Chyeo Yong
Year of Publication 22.06.2017