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Heat spreading layer integrated within a composite IC die structure and methods of forming the same
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Year of Publication 14.02.2023
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DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES
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Year of Publication 30.10.2024
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MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
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Year of Publication 24.10.2024
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Year of Publication 24.10.2024
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Year of Publication 24.10.2024
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Year of Publication 24.10.2024
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Process Development and Performance Benefits of 0.64-0.36 μm Pitch Hybrid Bonding on Intel Process
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Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Power delivery structures
Swan, Johanna, Eid, Feras, Dogiamis, Georgios, Choi, Beomseok, Braunisch, Henning, Bharath, Krishna, Elsherbini, Adel, Lambert, William
Year of Publication 10.09.2024
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Year of Publication 10.09.2024
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CONTACTLESS COMMUNICATION USING A WAVEGUIDE EXTENDING THROUGH A SUBSTRATE CORE
KAMGAING, Telesphor, SWAN, Johanna, PRABHU GAUNKAR, Neelam, DOGIAMIS, Georgios
Year of Publication 21.12.2022
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Year of Publication 21.12.2022
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Microelectronic assemblies with communication networks
Liff, Shawna M, Elsherbini, Adel A, Chandrasekhar, Arun, Elshazly, Amr, Swan, Johanna M
Year of Publication 03.09.2024
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Year of Publication 03.09.2024
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DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES
Aleksov, Aleksandar, Eid, Feras, Liff, Shawna M, Elsherbini, Adel A, Swan, Johanna M
Year of Publication 15.08.2024
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Year of Publication 15.08.2024
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