HIGH-DENSITY INTERCONNECTS FOR INTEGRATED CIRCUIT PACKAGES
Liff, Shawna, Swan, Johanna, Aleksov, Aleksandar, Strong, Veronica, Braunisch, Henning, Rawlings, Brandon
Year of Publication 18.11.2021
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Year of Publication 18.11.2021
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Sacrificial redistribution layer in microelectronic assemblies having direct bonding
Lift, Shawna M, Rawlings, Brandon M, Elsherbini, Adel A, Shakya, Jagat, Craig, David M, Strong, Veronica Aleman, Mueller, Brennen Karl, Streifer, Jeremy Alan, Swan, Johanna M
Year of Publication 05.09.2023
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Year of Publication 05.09.2023
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INTERCONNECTION STRUCTURE FABRICATION USING GRAYSCALE LITHOGRAPHY
Liff, Shawna, Swan, Johanna, Aleksov, Aleksandar, Strong, Veronica, Braunisch, Henning, Rawlings, Brandon
Year of Publication 04.11.2021
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Year of Publication 04.11.2021
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TECHNOLOGIES FOR PROVIDING A COGNITIVE CAPACITY TEST FOR AUTONOMOUS DRIVING
AZIZI, Shahrnaz, SWAN, Johanna, BASKARAN, Rajashree, ORTIZ, Melissa, ADENWALA, Fatema, YU, Mengjie
Year of Publication 03.11.2021
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Year of Publication 03.11.2021
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GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY
THEN, Han Wui, RADOSAVLJEVIC, Marko, KOIRALA, Pratik, FISCHER, Paul B, TALUKDAR, Tushar, SWAN, Johanna M, GOMES, Wilfred, CHOI, Beomseok, THOMAS, Nicole K, ELSHERBINI, Adel A, CHAU, Robert S
Year of Publication 02.08.2023
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Year of Publication 02.08.2023
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Microelectronic package electrostatic discharge (ESD) protection
Aleksov, Aleksandar, Eid, Feras, Elsherbini, Adel A, Strong, Veronica Aleman, Swan, Johanna M
Year of Publication 12.10.2021
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Year of Publication 12.10.2021
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DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES
OSBORNE, Randy B, LIFF, Shawna M, SWAN, Johanna M, EID, Feras, LE, Van H, ALEKSOV, Aleksandar, ELSHERBINI, Adel A
Year of Publication 26.07.2023
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Year of Publication 26.07.2023
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High-density interconnects for integrated circuit packages
Liff, Shawna, Swan, Johanna, Aleksov, Aleksandar, Strong, Veronica, Braunisch, Henning, Rawlings, Brandon
Year of Publication 28.09.2021
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Year of Publication 28.09.2021
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INORGANIC DIES WITH ORGANIC INTERCONNECT LAYERS AND RELATED STRUCTURES
Aleksov, Aleksandar, Eid, Feras, Dogiamis, Georgios, Swan, Johanna M, Kamgaing, Telesphor
Year of Publication 23.09.2021
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Year of Publication 23.09.2021
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MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
ELSHAZLY, Amr, CHANDRASEKHAR, Arun, LIFF, Shawna M, SWAN, Johanna M, ELSHERBINI, Adel A
Year of Publication 01.09.2021
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Year of Publication 01.09.2021
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MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
ELSHAZLY, Amr, CHANDRASEKHAR, Arun, LIFF, Shawna M, SWAN, Johanna M, ELSHERBINI, Adel A
Year of Publication 01.09.2021
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Year of Publication 01.09.2021
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SEMICONDUCTOR PACKAGE INCLUDING A MODULAR SIDE RADIATING WAVEGUIDE LAUNCHER
SWAN, JOHANNA, OSTER, SASHA, LIFF, SHAWNA, KAMGAING, TELESPHOR, DOGIAMIS, GEORGIOS, ELSHERBINI, ADEL, ALEKSOV, ALEKSANDAR
Year of Publication 26.08.2021
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Year of Publication 26.08.2021
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Microelectronic assemblies
Mueller, Brennen, Morrow, Patrick, Liff, Shawna M, Elsherbini, Adel A, Fischer, Paul B, Braunisch, Henning, Jun, Kimin, Swan, Johanna M
Year of Publication 19.07.2022
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Year of Publication 19.07.2022
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Interconnection structure fabrication using grayscale lithography
Liff, Shawna, Swan, Johanna, Aleksov, Aleksandar, Strong, Veronica, Braunisch, Henning, Rawlings, Brandon
Year of Publication 24.08.2021
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Year of Publication 24.08.2021
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Composite IC chips including a chiplet embedded within metallization layers of a host IC chip
Liff, Shawna, Swan, Johanna, Morrow, Patrick, Le, Van, Elsherbini, Adel, Pasdast, Gerald
Year of Publication 17.08.2021
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Year of Publication 17.08.2021
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