Package spark gap structure
Aleksov, Aleksandar, Eid, Feras, Elsherbini, Adel A, Strong, Veronica Aleman, Swan, Johanna M
Year of Publication 31.05.2022
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Year of Publication 31.05.2022
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Microelectronic assemblies
Liff, Shawna M, Elsherbini, Adel A, Chandrasekhar, Arun, Swan, Johanna M
Year of Publication 31.05.2022
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Year of Publication 31.05.2022
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Microelectronic assemblies
Liff, Shawna M, Elsherbini, Adel A, Chandrasekhar, Arun, Swan, Johanna M
Year of Publication 24.05.2022
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Year of Publication 24.05.2022
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Microelectronic assemblies with communication networks
Lift, Shawna M, Elsherbini, Adel A, Chandrasekhar, Arun, Elshazly, Amr, Swan, Johanna M
Year of Publication 24.05.2022
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Year of Publication 24.05.2022
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Microelectronic assemblies
Liff, Shawna M, Elsherbini, Adel A, Chandrasekhar, Arun, Swan, Johanna M
Year of Publication 17.05.2022
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Year of Publication 17.05.2022
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Fast-lane routing for multi-chip packages
Singh, Tejpal, Pasdast, Gerald S, Liff, Shawna M, Elsherbini, Adel A, Swan, Johanna M
Year of Publication 17.05.2022
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Year of Publication 17.05.2022
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DIE BACKEND DIODES FOR ELECTROSTATIC DISCHARGE (ESD) PROTECTION
Aleksov, Aleksandar, Eid, Feras, Elsherbini, Adel A, Strong, Veronica Aleman, Swan, Johanna M
Year of Publication 12.05.2022
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Year of Publication 12.05.2022
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Capacitor-wirebond pad structures for integrated circuit packages
Aleksov, Aleksandar, Eid, Feras, Dogiamis, Georgios, Swan, Johanna M, Kamgaing, Telesphor
Year of Publication 10.05.2022
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Year of Publication 10.05.2022
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PACKAGE ARCHITECTURE OF LARGE DIES USING QUASI-MONOLITHIC CHIP LAYERS
Pasdast, Gerald S, Siers, Scott E, Seangatith, Jiraporn, Liff, Shawna M, Elsherbini, Adel A, Tiagaraj, Sathya Narasimman, Kabir, Mohammad Enamul, Braunisch, Henning, Jun, Kimin, Swan, Johanna M
Year of Publication 22.02.2024
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Year of Publication 22.02.2024
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LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES
Liff, Shawna, Karhade, Omkar, Swan, Johanna, Aleksov, Aleksandar, Seangatith, Jiraporn, Talukdar, Tushar, Strong, Veronica, Kabir, Mohammad Enamul, Elsherbini, Adel, Jun, Kimin
Year of Publication 22.02.2024
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Year of Publication 22.02.2024
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MODULAR PACKAGE ARCHITECTURE FOR VOLTAGE REGULATOR-COMPUTE-MEMORY CIRCUITS WITH QUASI-MONOLITHIC CHIP LAYERS
Sebot, Julien, Liff, Shawna M, Elsherbini, Adel A, Choi, Beomseok, Radhakrishnan, Kaladhar, Augustine, Anne, Karhade, Omkar G, Valavala, Krishna Vasanth, Jun, Kimin, Swan, Johanna M
Year of Publication 22.02.2024
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Year of Publication 22.02.2024
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DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A COMPOSITE CHIPLET
Karhade, Omkar, Liff, Shawna, Swan, Johanna, Niazi, Haris Khan, Eid, Feras, Brun, Xavier, Talukdar, Tushar, Kabir, Mohammad Enamul, Elsherbini, Adel, Jun, Kimin, Krishnatreya, Bhaskar Jyoti
Year of Publication 22.02.2024
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Year of Publication 22.02.2024
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PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC CHIP LAYERS
Sounart, Thomas, Liff, Shawna M, Elsherbini, Adel A, Lambert, William J, Radhakrishnan, Kaladhar, Kabir, Mohammad Enamul, Braunisch, Henning, Karhade, Omkar G, Jun, Kimin, Swan, Johanna M
Year of Publication 22.02.2024
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Year of Publication 22.02.2024
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QUASI-MONOLITHIC DIE ARCHITECTURES
Brun, Xavier Francois, Eid, Feras, Liff, Shawna M, Elsherbini, Adel A, Mallik, Debendra, Valavala, Krishna Vasanth, Jun, Kimin, Swan, Johanna M, Krishnatreya, Bhaskar Jyoti
Year of Publication 22.02.2024
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Year of Publication 22.02.2024
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Multi-filter die
Aleksov, Aleksandar, Dogiamis, Georgios, Eid, Feras, Swan, Johanna M, Kamgaing, Telesphor
Year of Publication 26.04.2022
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Year of Publication 26.04.2022
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