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Published in Japanese Journal of Applied Physics (01.05.2013)
Published in Japanese Journal of Applied Physics (01.05.2013)
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TAKAOKA HIROMICHI, NAKASHIBA YASUTAKA, SONODA KENICHIRO, TSUCHIYA HIDEAKI, SUZUMURA NAOHITO
Year of Publication 14.03.2023
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Patent
Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression
Tsuchiya, Hideaki, Suzumura, Naohito, Shibata, Ryuji, Aono, Hideki, Ogasawara, Makoto, Akiba, Toshihiko, Sakata, Kenji, Nakagawa, Kazuyuki, Funaya, Takuo
Published in 2019 IEEE International Reliability Physics Symposium (IRPS) (01.03.2019)
Published in 2019 IEEE International Reliability Physics Symposium (IRPS) (01.03.2019)
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Conference Proceeding
Impact of Al in Cu alloy interconnects on electro and stress migration reliabilities
Maekawa, Kazuyoshi, Mori, Kenichi, Suzumura, Naohito, Honda, Kazuhito, Hirose, Yukinori, Asai, Koyu, Uedono, Akira, Kojima, Masayuki
Published in Microelectronic engineering (01.10.2008)
Published in Microelectronic engineering (01.10.2008)
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Conference Proceeding
Cu Dual-Damascene Interconnects with Direct Chemical Mechanical Polishing Process on Porous Low-$k$ Film
Izumitani, Junko, Kodama, Daisuke, Kido, Shigenori, Chibahara, Hiroyuki, Oka, Yoshihiro, Goto, Kinya, Suzumura, Naohito, Fujisawa, Masahiko, Miyatake, Hiroshi
Published in Japanese Journal of Applied Physics (01.05.2010)
Published in Japanese Journal of Applied Physics (01.05.2010)
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