Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy
Watanabe, Shinji, Sakai, Hiroshi, Suzuki, Motoji, Igarashi, Makoto, Tanaka, Akihiro
Year of Publication 12.07.2005
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Year of Publication 12.07.2005
Patent
Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy
TANAKA, AKIHIRO, SAKAI, HIROSHI, SUZUKI, MOTOJI, WATANABE, SHINJI, IGARASHI, MAKOTO
Year of Publication 15.09.2004
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Year of Publication 15.09.2004
Patent