Search Results - "SUWABE HITOSHI" :: K.UTB vyhledávací portál

Study on factors affecting wafer actions during double-sided lapping

by SUWABE, Hitoshi, KAMIMURA, Takuya, ISHIKAWA, Ken-ichi
Published in Journal of the Japan Society for Abrasive Technology (01.09.2022)

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Study on fixed diamond grains on resin-coated wire and slicing characteristics

by SUWABE, Hitoshi, ITO, Daiki, ISHIKAWA, Ken-ichi
Published in Journal of the Japan Society for Abrasive Technology (01.09.2020)

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Study on high-precision slicing of SiC using a multi-wire saw with resin-coated wire

by SUWABE, Hitoshi, MIZOTA, Yuhi, ISHIKAWA, Ken-ichi
Published in Journal of the Japan Society for Abrasive Technology (01.02.2019)

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Application of sugar-based-polyol to working fluid in wire saw

by TAKAHASHI, Mayuko, KIMURA, Yuki, TOCHIO, Takumi, KITAGAWA, Yasushi, SUWABE, Hitoshi
Published in Journal of the Japan Society for Abrasive Technology (01.09.2020)

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Processing characteristics of diamond wire saw: Relation between grains on diamond wire tool and processing characteristics

by SUWABE, Hitoshi, KUBOTA, Takuya, ISHIKAWA, Ken-ichi
Published in Journal of the Japan Society for Abrasive Technology (01.02.2017)

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両面ラッピング加工中のウェーハ挙動に影響を与える因子に関する研究

by 諏訪部, 仁, 上村, 拓也, 石川, 憲一
Published in 砥粒加工学会誌 (01.09.2022)

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Processing characteristics of rocking vibration multi-wire saw

by SUWABE, Hitoshi, YOTSUDA, Kazutaka, ISHIKAWA, Keni-chi
Published in Journal of the Japan Society for Abrasive Technology (01.06.2015)

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Slurry actions of milli-bubble by lapping of grating groove

by SUWABE, Hitoshi, HIROKAWA, Kengo, ISHIKAWA, Ken-ichi
Published in Journal of the Japan Society for Abrasive Technology (01.06.2019)

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Grain actions at sliced groove bottom of multi-wire saw

by SUWABE, Hitoshi, YOTSUDA, Kazutaka, ISHIKAWA, Keni-chi
Published in Journal of the Japan Society for Abrasive Technology (01.11.2014)

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ダイヤモンドワイヤソーの加工特性に関する研究: ワイヤ工具表面の砥粒と加工特性の関係

by 諏訪部, 仁, 久保田, 拓也, 石川, 憲一
Published in Journal of the Japan Society for Abrasive Technology (01.01.2017)

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樹脂コーティングワイヤに食込む砥粒と切断特性に関する研究

by 諏訪部, 仁, 伊藤, 大貴, 石川, 憲一
Published in 砥粒加工学会誌 (01.09.2020)

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ワイヤソーにおける還元水あめの加工液への利用: 食品素材を利用した作業環境改善への取り組みの基礎研究

by 高橋, 真裕子, 木村, 雄輝, 栃尾, 巧, 北川, 泰, 諏訪部, 仁
Published in 砥粒加工学会誌 (01.09.2020)

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ラッピング加工における格子溝定盤上のミリバブルスラリー挙動

by 諏訪部, 仁, 廣川, 健悟, 石川, 憲一
Published in 砥粒加工学会誌 (01.06.2019)

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樹脂コーティングワイヤを用いたマルチワイヤソーによるSiCの高精度加工

by 諏訪部, 仁, 溝田, 勇飛, 石川, 憲一
Published in 砥粒加工学会誌 (01.02.2019)

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Ultrasonic vibration grinding of aluminum alloy

by SUWABE, Hitoshi, ISHIZAWA, Tuyoshi, Ishikawa, Ken-ichi, TAKE, Masashi
Published in Journal of the Japan Society for Abrasive Technology (01.03.2014)

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