Warpage analysis and improvement for a power module
Yong Liu, Yumin Liu, Zhongfa Yuan, Chen, Tyler, Keunhyuk Lee, Belani, Suresh
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Investigation of interface delamination in a SO8 package under reflow
Yumin Liu, Yong Liu, Belani, S., Oseob Jeon
Published in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2012)
Published in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2012)
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Conference Proceeding
Common drain power clip for battery pack protection mosfet
YOON SUNGGEUN, BELANI SURESH, WU CHUNG-LIN, SAPP STEVEN, DOSDOS BIGILDIS
Year of Publication 28.06.2016
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Year of Publication 28.06.2016
Patent
Characterization of Al wire wedge bonding in power electronics package
Yumin Liu, Yong Liu, Keller, D., Belani, S., Dube, M.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Multi-chip module power clip
YOON SUNGGEUN, BELANI SURESH, WU CHUNG-LIN, SAPP STEVEN, DOSDOS BIGILDIS
Year of Publication 13.05.2014
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Year of Publication 13.05.2014
Patent
COMMON DRAIN POWER CLIP FOR BATTERY PACK PROTECTION MOSFET
YOON SUNGGEUN, BELANI SURESH, WU CHUNG-LIN, SAPP STEVEN, DOSDOS BIGILDIS
Year of Publication 13.03.2014
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Year of Publication 13.03.2014
Patent
MULTI-CHIP MODULE POWER CLIP
YOON SUNGGEUN, BELANI SURESH, WU CHUNG-LIN, SAPP STEVEN, DOSDOS BIGILDIS
Year of Publication 13.02.2014
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Year of Publication 13.02.2014
Patent