Method of fabricating solder bumps with high coplanarity for flip-chip application
JAO JUI-MENG, CHEN CHIH-SHUN, SUO CHAO-DUNG, CHIEN FENG-LUNG, YANG KEUAN
Year of Publication 19.02.2002
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Year of Publication 19.02.2002
Patent
Method of fabricating solder bumps with high coplanarity for flip-chip application
Chen, Chih-Shun, Suo, Chao-Dung, Jao, Jui-Meng, Yang, Ke-Chuan, Chien, Feng-Lung
Year of Publication 19.02.2002
Get full text
Year of Publication 19.02.2002
Patent