Air conditioner and a method for controlling an air conditioner
Seo, Sungho, Park, Bohee, Park, Hyunjin, Lee, Donghwal, Jang, Ji Hyun
Year of Publication 13.02.2024
Get full text
Year of Publication 13.02.2024
Patent
Storage device and storage system including the same
Seo, Sungho, Noh, Kwanwoo, Nam, Dongwoo, Shin, Myungsub, Jeong, Yongwoo, Jang, Hyunkyu
Year of Publication 16.01.2024
Get full text
Year of Publication 16.01.2024
Patent
STORAGE DEVICE FOR HIGH SPEED LINK STARTUP AND STORAGE SYSTEM INCLUDING THE SAME
NAM, Dongwoo, JUNG, Haesung, SEO, Sungho, NOH, Kwanwoo, SHIN, Myungsub
Year of Publication 23.02.2022
Get full text
Year of Publication 23.02.2022
Patent
STORAGE DEVICE FOR HIGH SPEED LINK STARTUP AND STORAGE SYSTEM INCLUDING THE SAME
NAM, Dongwoo, JUNG, Haesung, SEO, Sungho, NOH, Kwanwoo, SHIN, Myungsub
Year of Publication 23.12.2021
Get full text
Year of Publication 23.12.2021
Patent
HOST CONTROLLER INTERFACE USING MULTIPLE CIRCULAR QUEUE, AND OPERATING METHOD THEREOF
JUNG, Haesung, JANG, Seongyong, SEO, Sungho, NOH, Kwanwoo, SHIN, Myungsub
Year of Publication 08.12.2021
Get full text
Year of Publication 08.12.2021
Patent
HOST CONTROLLER INTERFACE USING MULTIPLE CIRCULAR QUEUE, AND OPERATING METHOD THEREOF
JUNG, Haesung, JANG, Seongyong, SEO, Sungho, NOH, Kwanwoo, SHIN, Myungsub
Year of Publication 02.12.2021
Get full text
Year of Publication 02.12.2021
Patent
STORAGE DEVICE AND STORAGE SYSTEM INCLUDING THE SAME
NAM, Dongwoo, JEONG, Yongwoo, JANG, Hyunkyu, SEO, Sungho, NOH, Kwanwoo, SHIN, Myungsub
Year of Publication 13.04.2023
Get full text
Year of Publication 13.04.2023
Patent
Storage device and storage system including the same
Seo, Sungho, Noh, Kwanwoo, Nam, Dongwoo, Shin, Myungsub, Jeong, Yongwoo, Jang, Hyunkyu
Year of Publication 24.01.2023
Get full text
Year of Publication 24.01.2023
Patent
Storage device, user device including storage device, and operation method of user device
Seo, Sungho, Choi, JinHyeok, Park, Hyuntae, Youn, Ji-Seung, Lee, Youngmin, Oh, Hwaseok
Year of Publication 23.08.2022
Get full text
Year of Publication 23.08.2022
Patent
Bottom-up Cu Filling of through-Silicon-Via(TSV) with Single Additive
Jin, Sanghyun, Seo, Sungho, Park, Sangwoo, Yoo, Bongyoung
Published in Meeting abstracts (Electrochemical Society) (01.09.2016)
Published in Meeting abstracts (Electrochemical Society) (01.09.2016)
Get full text
Journal Article