An optimization method of package warpage simulation based on parameter calibration
Song, Tingting, Shao, Guangping, Wang, Zongwei, Pang, Jian, Tuobei, Sun, Ouyang, Keqing
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Multi-chips High-density Interconnection Design on InFO Platform
Qiang, Jiang, Guodan, Zhou, Zongwei, Wang, Jian, Pang, Tuobei, Sun, Ouyang, Keqing
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
Influence of package parasitic parameters on CDM performance based on 2.5D and 2D package
Long, Zhijun, Liu, Nie, Yang, Dan, Mei, Na, Sun, Tuobei
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Identification of electromigration failure mechanism dominated in FCBGA applications
Wu, Xiaopeng, Sun, Niuyi, Yang, Dan, Mei, Na, Sun, Tuobei
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Suppression and Optimization of 32G serdes power noise for FCBGA Packaging
Zhang, Jianguo, Ma, Shineng, Chen, Qiang, Pang, Jian, Sun, Tuobei
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Research on improvement of reference voltage shift of wire-bound products
Chen, Yang, Mei, Na, Sun, Tuobei
Published in 2020 China Semiconductor Technology International Conference (CSTIC) (26.06.2020)
Published in 2020 China Semiconductor Technology International Conference (CSTIC) (26.06.2020)
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Conference Proceeding
Improving Optical and Electronic Performance of Monolayer Silicon Carbide via Metal Doping
Li, Junfeng, Tang, Yanlong, Xu, Siyuan, Lin, Tao, Sun, Tuobei, Ye, Huaiyu
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
Strain Engineering for Modulating Electronic and Optoelectronic Properties of Monolayer InSe
Xu, Siyuan, Sun, Tuobei, Li, Junfeng, Lin, Tao, Yang, Huiru, Ye, Huaiyu
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
112G High Speed Interface Package Design and Simulation
Zhang, Jiangtao, Zhang, Li, Pang, Jian, Sun, Tuobei, Ouvang, Keqing
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
Research on the Improvement of SI Performance of High Bandwidth Memory Interface by New 2.5D Silicon Interposer Structure
Chen, Xiaolang, Pang, Jian, Zhang, Jiangtao, Sun, Tuobei
Published in 2021 China Semiconductor Technology International Conference (CSTIC) (14.03.2021)
Published in 2021 China Semiconductor Technology International Conference (CSTIC) (14.03.2021)
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Conference Proceeding
Board-Level Thermal Cycle Simulation and Improvement of 2.5D Large-Size Package
Chen, Shiyu, Yang, Dan, Mei, Na, Sun, Tuobei, Ouyang, Keqing
Published in 2021 China Semiconductor Technology International Conference (CSTIC) (14.03.2021)
Published in 2021 China Semiconductor Technology International Conference (CSTIC) (14.03.2021)
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Conference Proceeding
A Study of Thermal Interface Materials with Different Thermal Conductivity for HFCBGA Package
Wang, Feng, Mei, Na, Lai, Yuanting, Sun, Tuobei, Ouyang, Keqing
Published in 2021 China Semiconductor Technology International Conference (CSTIC) (14.03.2021)
Published in 2021 China Semiconductor Technology International Conference (CSTIC) (14.03.2021)
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Conference Proceeding
Study on Stress Migration of FCQFN Package with Unbalanced Arrangement of Bumps
Chao, Shuanshe, Lin, Xinyi, Yang, Dan, Mei, Na, Sun, Tuobei, Ouyang, Keqing
Published in 2022 China Semiconductor Technology International Conference (CSTIC) (20.06.2022)
Published in 2022 China Semiconductor Technology International Conference (CSTIC) (20.06.2022)
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Conference Proceeding
Fault Localization of Functional Failure by using Dynamic EMMI Analysis Technique
Ouyang, Keqing, Wei, Xixiong, Lin, Xinyi, Yang, Dan, Mei, Na, Sun, Tuobei
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Reliability Improvement Research of 2.5D CoWoS package
Ouyang, Keqing, Li, Lan, Fang, Jianmin, Shao, Guangping, Mei, Na, Sun, Tuobei
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Method of Improving Simulation Accuracy by Curing Shrinkage of Molding Compound
Neng, Liqiang, Wang, Zongwei, Pang, Jian, Sun, Tuobei, Li, Guangyao, Ouyang, Keqing
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Investigation on the thermo-mechanical reliability of bump with different solder shape in ultra-large size FCBGA package
Wu, Zhuolun, Wang, Weilun, Wang, Zhuqiu, Yang, Dan, Mei, Na, Sun, Tuobei
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Investigation on Yield Improvement of Fan-Out Wafer-Level Packaging
Zhu, Kai, Chao, Shuanshe, Chen, Yang, Mei, Na, Fang, Jianmin, Sun, Tuobei, Ouyang, Keqing
Published in 2022 China Semiconductor Technology International Conference (CSTIC) (20.06.2022)
Published in 2022 China Semiconductor Technology International Conference (CSTIC) (20.06.2022)
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Conference Proceeding
2.5D Package SI&PI Assessment Approach
Zhang, Jiangtao, Yu, Bin, Pang, Jian, Sun, Tuobei, Chen, Xiaolang
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
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Conference Proceeding