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"SUN, U GYUN"
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a manufacture method of super slim ceramic package with metalic bump
by
SUN
,
U GYUN
Year of Publication
09.08.2003
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PACKAGE STRUCTURE AND SENSOR MODULE OF PACKAGE STRUCTURE BY USING PRESS MOLDING METHOD TO SIMPLIFY FABRICATION PROCESS
by
SUN
,
U GYUN
,
JUN, IN SU
,
LEE, HYEONG GYU
,
LEE, YUN SEOP
Year of Publication
16.11.2004
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basic electric elements
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electric solid state devices not otherwise provided for
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