Search Results - "SUHR, Dominique" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

ELECTROLYTE AND METHOD FOR ELECTRODEPOSITING COPPER ONTO A BARRIER LAYER

ELECTROLYTE AND METHOD FOR ELECTRODEPOSITING COPPER ONTO A BARRIER LAYER

by RELIGIEUX, LAURIANNE, MEVELLEC, VINCENT, SUHR, DOMINIQUE
Year of Publication 29.07.2015

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Patent

SOLUTION AND METHOD FOR ACTIVATING THE OXIDIZED SURFACE OF A SEMICONDUCTOR SUBSTRATE

SOLUTION AND METHOD FOR ACTIVATING THE OXIDIZED SURFACE OF A SEMICONDUCTOR SUBSTRATE

by MEVELLEC, VINCENT, SUHR, DOMINIQUE
Year of Publication 07.04.2011

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Patent

SOLUTION AND METHOD FOR ACTIVATING THE OXIDIZED SURFACE OF A SEMICONDUCTOR SUBSTRATE

SOLUTION AND METHOD FOR ACTIVATING THE OXIDIZED SURFACE OF A SEMICONDUCTOR SUBSTRATE

by MEVELLEC, VINCENT, SUHR, DOMINIQUE
Year of Publication 07.04.2011

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Patent

SOLUTION AND PROCESS FOR ACTIVATING THE SURFACE OF A SEMICONDUCTIVE SUBSTRATE

SOLUTION AND PROCESS FOR ACTIVATING THE SURFACE OF A SEMICONDUCTIVE SUBSTRATE

by MEVELLEC, VINCENT, SUHR, DOMINIQUE
Year of Publication 17.03.2011

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Patent

SOLUTION AND PROCESS FOR ACTIVATING THE SURFACE OF A SEMICONDUCTIVE SUBSTRATE

SOLUTION AND PROCESS FOR ACTIVATING THE SURFACE OF A SEMICONDUCTIVE SUBSTRATE

by MEVELLEC, VINCENT, SUHR, DOMINIQUE
Year of Publication 17.03.2011

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Patent

COPPER ELECTRODEPOSITION BATH CONTAINING AN ELECTROCHEMICALLY INERT CATION

COPPER ELECTRODEPOSITION BATH CONTAINING AN ELECTROCHEMICALLY INERT CATION

by RELIGIEUX, LAURIANNE, SUHR, DOMINIQUE, BLONDEAU, PAUL
Year of Publication 18.06.2015

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Patent

COPPER ELECTRODEPOSITION BATH CONTAINING AN ELECTROCHEMICALLY INERT CATION

COPPER ELECTRODEPOSITION BATH CONTAINING AN ELECTROCHEMICALLY INERT CATION

by RELIGIEUX LAURIANNE, SUHR DOMINIQUE, BLONDEAU PAUL
Year of Publication 11.06.2015

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Patent

Electrolyte and method for electrodepositing copper onto a barrier layer

Electrolyte and method for electrodepositing copper onto a barrier layer

by SUHR DOMINIQUE, RELIGIEUX LAURIANNE, MEVELLEC VINCENT
Year of Publication 03.06.2015

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Patent

ELECTROLYTE AND PROCESS FOR ELECTROPLATING COPPER ONTO ABARRIER LAYER

ELECTROLYTE AND PROCESS FOR ELECTROPLATING COPPER ONTO ABARRIER LAYER

by RELIGIEUX, LAURIANNE, MEVELLEC, VINCENT, SUHR, DOMINIQUE
Year of Publication 28.05.2015

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Patent

PROCESS OF PREPARING AN ELECTRICAL ISOLATION FILM AND APPLICATION FOR THE METALLISATION OF THROUGH VIAS

PROCESS OF PREPARING AN ELECTRICAL ISOLATION FILM AND APPLICATION FOR THE METALLISATION OF THROUGH VIAS

by GONZALEZ, JOSÉ, MEVELLEC, VINCENT, SUHR, DOMINIQUE
Year of Publication 17.12.2014

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Patent

Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate; kit for application of said method

Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate; kit for application of said method

by MEVELLEC, VINCENT, SUHR, DOMINIQUE
Year of Publication 01.10.2016

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Patent

Electrolyte and method for cobalt electrodeposition

Electrolyte and method for cobalt electrodeposition

by THIAM, MIKAILOU, BERTHON, HERMINE MARIE, KIM, YEESEUL, DOUSSOT, CELINE PASCALE, SUHR, DOMINIQUE
Year of Publication 21.08.2023

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Patent

Solution and process for activating the surface of a semiconductive substrate

Solution and process for activating the surface of a semiconductive substrate

by MEVELLEC, VINCENT, SUHR, DOMINIQUE
Year of Publication 21.08.2016

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Patent

Solution and method for activating the oxidized surface of a semiconductor substrate

Solution and method for activating the oxidized surface of a semiconductor substrate

by MEVELLEC, VINCENT, SUHR, DOMINIQUE
Year of Publication 21.08.2016

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Patent

NEW ORGANO-METALLIC WET COATING METHOD TO ENHANCE ELECTRO-MIGRATION RESISTANCE

NEW ORGANO-METALLIC WET COATING METHOD TO ENHANCE ELECTRO-MIGRATION RESISTANCE

by BISPO, ISABELLE, SUHR, DOMINIQUE
Year of Publication 14.05.2010

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Patent

ELECTROLYTE ET PROCEDE D'ELECTRODEPOSITION DE CUIVRE SUR UNE COUCHE BARRIERE

ELECTROLYTE ET PROCEDE D'ELECTRODEPOSITION DE CUIVRE SUR UNE COUCHE BARRIERE

by SUHR DOMINIQUE, RELIGIEUX LAURIANNE, MEVELLEC VINCENT
Year of Publication 10.10.2014

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Patent

Method for temporary or permanent wafer bonding

Method for temporary or permanent wafer bonding

by MEVELLEC, VINCENT, DOUSSOT, CELINE, SUHR, DOMINIQUE
Year of Publication 16.01.2020

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Patent

Electrografted Copper Seed Layer for High Aspect Ratio TSVs Interposer Metallization

Electrografted Copper Seed Layer for High Aspect Ratio TSVs Interposer Metallization

by Gaillard, Frédéric, Mourier, Thierry, Vandroux, Laurent, Religieux, Laurianne, Suhr, Dominique, Raynal, Frédéric, Mevellec, Vincent
Published in Meeting abstracts (Electrochemical Society) (05.08.2014)

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Journal Article

ELECTRODEPOSITION OF A COBALT OR COPPER ALLOY, AND USE IN MICROELECTRONICS

ELECTRODEPOSITION OF A COBALT OR COPPER ALLOY, AND USE IN MICROELECTRONICS

by SUHR DOMINIQUE, MEVELLEC VINCENT, THIAM MIKAILOU, CAILLARD LOUIS
Year of Publication 10.09.2021

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Patent

Procédé simulation de dépôt par électrodéposition d'une couche métallique sur une plaquette, et système correspondant

Procédé simulation de dépôt par électrodéposition d'une couche métallique sur une plaquette, et système correspondant

by MEVELLEC, Vincent, CAILLARD, Louis, SUHR, Dominique, THIAM, Mikaïlou
Year of Publication 30.04.2021

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Patent

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