High Thermal Boundary Conductance across Bonded Heterogeneous GaN–SiC Interfaces
Mu, Fengwen, Cheng, Zhe, Shi, Jingjing, Shin, Seongbin, Xu, Bin, Shiomi, Junichiro, Graham, Samuel, Suga, Tadatomo
Published in ACS applied materials & interfaces (11.09.2019)
Published in ACS applied materials & interfaces (11.09.2019)
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Journal Article
Evidence for intermolecular forces involved in ladybird beetle tarsal setae adhesion
Hosoda, Naoe, Nakamoto, Mari, Suga, Tadatomo, Gorb, Stanislav N
Published in Scientific reports (08.04.2021)
Published in Scientific reports (08.04.2021)
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Journal Article
GaN-Si direct wafer bonding at room temperature for thin GaN device transfer after epitaxial lift off
Mu, Fengwen, Morino, Yuki, Jerchel, Kathleen, Fujino, Masahisa, Suga, Tadatomo
Published in Applied surface science (15.09.2017)
Published in Applied surface science (15.09.2017)
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Journal Article
Direct wafer bonding of Ga2O3–SiC at room temperature
Xu, Yang, Mu, Fengwen, Wang, Yinghui, Chen, Dapeng, Ou, Xin, Suga, Tadatomo
Published in Ceramics international (01.04.2019)
Published in Ceramics international (01.04.2019)
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Journal Article
Room Temperature Wafer Bonding of Glass Using Aluminum Oxide Intermediate Layer
Takeuchi, Kai, Mu, Fengwen, Matsumoto, Yoshiie, Suga, Tadatomo
Published in Advanced materials interfaces (01.03.2021)
Published in Advanced materials interfaces (01.03.2021)
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Journal Article
Sequential Plasma Activation for Low Temperature Bonding of Aluminosilicate Glass
Takeuchi, Kai, Mu, Fengwen, Yamauchi, Akira, Suga, Tadatomo
Published in ECS journal of solid state science and technology (01.05.2021)
Published in ECS journal of solid state science and technology (01.05.2021)
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Journal Article
Bonding of glass nanofluidic chips at room temperature by a one-step surface activation using an O2/CF4 plasma treatment
Xu, Yan, Wang, Chenxi, Li, Lixiao, Matsumoto, Nobuhiro, Jang, Kihoon, Dong, Yiyang, Mawatari, Kazuma, Suga, Tadatomo, Kitamori, Takehiko
Published in Lab on a chip (21.03.2013)
Published in Lab on a chip (21.03.2013)
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Journal Article
Sequential plasma activation methods for hydrophilic direct bonding at sub-200 °C
He, Ran, Yamauchi, Akira, Suga, Tadatomo
Published in Japanese Journal of Applied Physics (01.02.2018)
Published in Japanese Journal of Applied Physics (01.02.2018)
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Journal Article
Rapid pressureless and low-temperature bonding of large-area power chips by sintering two-step activated Ag paste
Fang, Hui, Wang, Chenxi, Zhou, Shicheng, Kang, Qiushi, Wang, Te, Yang, Dongsheng, Tian, Yanhong, Suga, Tadatomo
Published in Journal of materials science. Materials in electronics (01.04.2020)
Published in Journal of materials science. Materials in electronics (01.04.2020)
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Journal Article
Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au⁻Au Bonding Using Ultrathin Au Films
Yamamoto, Michitaka, Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Suga, Tadatomo, Itoh, Toshihiro, Higurashi, Eiji
Published in Micromachines (Basel) (13.02.2019)
Published in Micromachines (Basel) (13.02.2019)
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Journal Article
Low-temperature direct bonding of glass nanofluidic chips using a two-step plasma surface activation process
Xu, Yan, Wang, Chenxi, Dong, Yiyang, Li, Lixiao, Jang, Kihoon, Mawatari, Kazuma, Suga, Tadatomo, Kitamori, Takehiko
Published in Analytical and bioanalytical chemistry (01.01.2012)
Published in Analytical and bioanalytical chemistry (01.01.2012)
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Journal Article
Low temperature Cu bonding with large tolerance of surface oxidation
Ren, Hui, Mu, Fengwen, Shin, Seongbin, Liu, Lei, Zou, Guisheng, Suga, Tadatomo
Published in AIP advances (01.05.2019)
Published in AIP advances (01.05.2019)
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Journal Article