Search Results - "SUEMURA NAOHIKO" :: K.UTB vyhledávací portál

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Organosol of silica and process for producing the same

by YOSHITAKE KEIKO, SUEMURA NAOHIKO
Year of Publication 02.03.2011

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METHOD FOR INHIBITING OCCURRENCE OF CREEPING ELECTRICAL DISCHARGE

by KOZAKO MASAHIRO, HIKITA MASAYUKI, JANG KYUNGHOON, AKAHOSHI TAKAO, SUEMURA NAOHIKO, ISHIDA TOMOHISA
Year of Publication 19.03.2019

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Silica sol and silica-containing epoxy resin composition

by SUEMURA, NAOHIKO, SHIMADA, MEGUMI, KIKUNAGA, ICHITARO
Year of Publication 16.03.2015

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Verfahren zur Herstellung von Solen anorganischer Oxide

by SUEMURA, NAOHIKO, KOYAMA, YOSHINARI, YOSHITAKE, KEIKO
Year of Publication 21.05.2008

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Silica-containing epoxy curing agent and epoxy resin cured body

by TAKEYAMA TOSHIAKI, SUEMURA NAOHIKO
Year of Publication 03.11.2010

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Silica colloidal particles and production method thereof, and organic solvent-dispersed silica sol, polimerizable compound-dispersed silica sol and dicarboxylic anhydride-dispersed silica sol thereof

by SUEMURA, NAOHIKO, TAKEYAMA, TOSHIAKI, YOSHITAKE, KEIKO
Year of Publication 21.10.2014

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Epoxy resin-forming liquid preparation containing inorganic particle

by TAKEYAMA TOSHIAKI, SUEMURA NAOHIKO
Year of Publication 31.03.2010

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Process for producing inorganic oxide organosol

by SUEMURA, NAOHIKO, KOYAMA, YOSHINARI, YOSHITAKE, KEIKO
Year of Publication 22.08.2007

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Colloidal silica particles, process for producing the same, and silica sol in organic solvent, silica sol in polymerizable compound, and silica sol in dicarboxylic anhydride each obtained from the same

by YOSHITAKE KEIKO, TAKEYAMA TOSHIAKI, SUEMURA NAOHIKO
Year of Publication 06.08.2014

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Method for inhibiting occurrence of creeping electrical discharge

by SUEMURA, NAOHIKO, JANG, KYUNG-HOON, AKAHOSHI, TAKAO, KOZAKO, MASAHIRO, ISHIDA, TOMOHISA, HIKITA, MASAYUKI
Year of Publication 01.07.2018

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Silica sol having reactive monomer dispersed therein, method for producing the silica sol, curing composition, and cured article produced from the curing composition

by YOSHITAKE KEIKO, SUEMURA NAOHIKO
Year of Publication 09.12.2009

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Silica-containing epoxy curing agent and epoxy resin cured body

by SUEMURA, NAOHIKO, TAKEYAMA, TOSHIAKI
Year of Publication 01.10.2009

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Liquid epoxy resin forming formulation containing inorganic particles

by SUEMURA, NAOHIKO, TAKEYAMA, TOSHIAKI
Year of Publication 01.06.2009

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Polishing Composition for Silicon Wafer

by KASHIMA YOSHIYUKI, OHSHIMA MASAAKI, ISHIMIZU EIICHIROU, SUEMURA NAOHIKO
Year of Publication 21.05.2009

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Reactive monomer dispersed silica sol, method for producing the same, curing composition and cured product from the same

by SUEMURA, NAOHIKO, YOSHITAKE, KEIKO
Year of Publication 01.02.2009

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Process for producing inorganic oxide organosol

by SUEMURA, NAOHIKO, KOYAMA, YOSHINARI, YOSHITAKE, KEIKO
Year of Publication 18.01.2006

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PROCESS OF PRODUCING INORGANIC OXIDE ORGANOSOL

by YOSHITAKE KEIKO, KOYAMA KINYA, SUEMURA NAOHIKO
Year of Publication 28.07.2005

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Process for producing inorganic oxide organosol

by YOSHITAKE KEIKO, SUEMURA NAOHIKO, KOYAMA YOSHINARI
Year of Publication 14.07.2005

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Process for producing inorganic oxide organosol

by SUEMURA, NAOHIKO, KOYAMA, YOSHINARI, YOSHITAKE, KEIKO
Year of Publication 22.06.2005

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Silica sol and method for producing silica sol

by SUEMURA, NAOHIKO, SHIMADA, MEGUMI, KIKUNAGA, ICHITARO, YOSHITAKE, KEIKO
Year of Publication 16.03.2015

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