SILICON WAFER AND METHOD OF MANUFACTURING SILICON WAFER
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Year of Publication 13.01.2022
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ISHIKAWA Takashi, AOKI Tatsuhiko, IKEDA Shoji, SUDO Haruo, IZUNOME Koji, FUKUDA Etsuo, ENDOH Tetsuo, MATSUMURA Hisashi
Year of Publication 30.12.2021
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Year of Publication 30.12.2021
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Dislocation behavior of surface-oxygen-concentration controlled Si wafers
Asazu, Hirotada, Takeuchi, Shotaro, Sannai, Hiroya, Sudo, Haruo, Araki, Koji, Nakamura, Yoshiaki, Izunome, Koji, Sakai, Akira
Published in Thin solid films (30.04.2014)
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FLATTENING TREATMENT METHOD OF SILICON WAFER
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Year of Publication 13.09.2018
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Year of Publication 13.09.2018
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실리콘 웨이퍼의 열처리 방법
BANBA HIRONORI, OKAMURA HIDEYUKI, MAEDA SUSUMU, SUEOKA KOJI, NAKAMURA KOZO, ARAKI KOJI, SUDO HARUO
Year of Publication 13.02.2019
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Year of Publication 13.02.2019
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실리콘 웨이퍼
BANBA HIRONORI, OKAMURA HIDEYUKI, MAEDA SUSUMU, SUEOKA KOJI, NAKAMURA KOZO, ARAKI KOJI, SUDO HARUO
Year of Publication 08.01.2019
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Year of Publication 08.01.2019
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SILICON WAFER THERMAL PROCESSING METHOD
SUDO Haruo, SUEOKA Koji, BANBA Hironori, NAKAMURA Kozo, ARAKI Koji, MAEDA Susumu, OKAMURA Hideyuki
Year of Publication 07.12.2017
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Year of Publication 07.12.2017
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HEAT TREATMENT METHOD OF SILICON WAFER
BANBA HIRONORI, OKAMURA HIDEYUKI, MAEDA SUSUMU, SUEOKA KOJI, NAKAMURA KOZO, ARAKI KOJI, SUDO HARUO
Year of Publication 07.12.2017
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Year of Publication 07.12.2017
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SILICON WAFER
SUDO Haruo, SUEOKA Koji, BANBA Hironori, NAKAMURA Kozo, ARAKI Koji, MAEDA Susumu, OKAMURA Hideyuki
Year of Publication 02.11.2017
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Year of Publication 02.11.2017
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SILICON WAFER
BANBA HIRONORI, OKAMURA HIDEYUKI, MAEDA SUSUMU, SUEOKA KOJI, NAKAMURA KOZO, ARAKI KOJI, SUDO HARUO
Year of Publication 02.11.2017
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Year of Publication 02.11.2017
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