Electromigration in Sn-Bi Modified with Polyhedral Oligomeric Silsesquioxane
Zhang, Ruihong, Xu, Guangchen, Wang, Xitao, Guo, Fu, Lee, Andre, Subramanian, K. N.
Published in Journal of electronic materials (01.12.2010)
Published in Journal of electronic materials (01.12.2010)
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Conference Proceeding
Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys
TELANG, A. U, BIELER, T. R, LUCAS, J. P, SUBRAMANIAN, K. N, LEHMAN, L. P, XING, Y, COTTS, E. J
Published in Journal of electronic materials (01.12.2004)
Published in Journal of electronic materials (01.12.2004)
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Effect of anisotropy of tin on thermomechanical behavior of solder joints
SUBRAMANIAN, K. N, LEE, J. G
Published in Journal of materials science. Materials in electronics (01.04.2004)
Published in Journal of materials science. Materials in electronics (01.04.2004)
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Journal Article
Impact Behavior of Thermomechanically Fatigued Sn-Based Solder Joints
Kobayashi, Takayuki, Lee, Andre, Subramanian, K. N.
Published in Journal of electronic materials (01.12.2009)
Published in Journal of electronic materials (01.12.2009)
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Conference Proceeding
Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions
Guo, F., Choi, S., Subramanian, K.N., Bieler, T.R., Lucas, J.P., Achari, A., Paruchuri, M.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.06.2003)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.06.2003)
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Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles
GUO, F, LEE, J, CHOI, S, LUCAS, J. P, BIELER, T. R, SUBRAMANIAN, K. N
Published in Journal of electronic materials (01.09.2001)
Published in Journal of electronic materials (01.09.2001)
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Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging
Choi, S, Bieler, T R, Lucas, J P, Subramanian, K N
Published in Journal of electronic materials (01.11.1999)
Published in Journal of electronic materials (01.11.1999)
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A comparison of neonatal mortality risk prediction models in very low birth weight infants
Pollack, M M, Koch, M A, Bartel, D A, Rapoport, I, Dhanireddy, R, El-Mohandes, A A, Harkavy, K, Subramanian, K N
Published in Pediatrics (Evanston) (01.05.2000)
Published in Pediatrics (Evanston) (01.05.2000)
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Journal Article
Micromechanical characterization of thermomechanically fatigued lead-free solder joints
RHEE, H, LUCAS, J. P, SUBRAMANIAN, K. N
Published in Journal of materials science. Materials in electronics (01.08.2002)
Published in Journal of materials science. Materials in electronics (01.08.2002)
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Journal Article
Thermomechanical fatigue behavior of Sn-Ag solder joints
CHOI, S, SUBRAMANIAN, K. N, LUCAS, J. P, BIELER, T. R
Published in Journal of electronic materials (01.10.2000)
Published in Journal of electronic materials (01.10.2000)
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Conference Proceeding
Journal Article
Design of solder joints for fundamental studies on the effects of electromigration
HO, C. E, LEE, A, SUBRAMANIAN, K. N
Published in Journal of materials science. Materials in electronics (01.06.2007)
Published in Journal of materials science. Materials in electronics (01.06.2007)
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Journal Article
Modeling thermomechanical fatigue behavior of Sn-Ag solder joints
LEE, J. G, TELANG, A, SUBRMMNIAN, K. N, BIELER, T. R
Published in Journal of electronic materials (01.11.2002)
Published in Journal of electronic materials (01.11.2002)
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Conference Proceeding
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Effects of intermetallic morphology at the metallic particle/solder interface on mechanical properties of Sn-Ag-based solder joints
RHEE, H, GUO, F, LEE, J. G, CHEN, K. C, SUBRAMANIAN, K. N
Published in Journal of electronic materials (01.11.2003)
Published in Journal of electronic materials (01.11.2003)
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Conference Proceeding
Journal Article
Effects of reflow on wettability, microstructure and mechanical properties in lead-free solders
GUO, F, CHOI, S, LUCAS, J. P, SUBRAMANIAN, K. N
Published in Journal of electronic materials (01.10.2000)
Published in Journal of electronic materials (01.10.2000)
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Conference Proceeding
Journal Article
Orientation imaging studies of Sn-based electronic solder joints
Telang, A. A., Bieler, T. T., Choi, S., Subramanian, K. K.
Published in Journal of materials research (01.09.2002)
Published in Journal of materials research (01.09.2002)
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