Jobs Prediction Model based on Myanmar Labor Force Survey by using Artificial Neural Network
Nandar, Su, Lwin, Myint Myint
Published in 2023 IEEE Conference on Computer Applications (ICCA) (27.02.2023)
Published in 2023 IEEE Conference on Computer Applications (ICCA) (27.02.2023)
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Conference Proceeding
Rapid Reversal of Complete Binocular Blindness With High-Dose Corticosteroids and Lumbar Drain in a Solid Organ Transplant Recipient With Cryptococcal Meningitis and Immune Reconstitution Syndrome: First Case Study and Literature Review
Weiss, Zoe, Mehta, Nihaal, Aung, Su Nandar, Migliori, Michael, Farmakiotis, Dimitrios
Published in Open forum infectious diseases (01.02.2018)
Published in Open forum infectious diseases (01.02.2018)
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Journal Article
Development of radio-opaque silicon micro needles for medical diagnostics
Lim, Ruiqi, Nandar, Su, Chandrappan, Jayakrishnan, Tang, Shao Qiang, Vaidyanathan, Kripesh, Nagarajan, Ranganathan
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Development of Fine Pitch Solder Microbumps for 3D Chip Stacking
Aibin Yu, Kumar, A., Soon Wee Ho, Hnin Wai Yin, Lau, J.H., Khong Chee Houe, Lim Pei Siang, S., Xiaowu Zhang, Da-Quan Yu, Nandar Su, Chew Bi-Rong, M., Jong Ming Ching, Tan Teck Chun, Kripesh, V., Lee, C., Jun Pin Huang, Chiang, J., Chen, S., Chi-Hsin Chiu, Chang-Yueh Chan, Chin-Huang Chang, Chih-Ming Huang, Cheng-Hsu Hsiao
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Demonstration of high quality and low loss millimeter wave passives on embedded wafer level packaging platform (EMWLP)
Ying Ying Lim, Vempati, S.R., Nandar Su, Xianghua Xiao, Jinchang Zhou, Kumar, A., Phyo Phyo Thaw, Sharma, G., Teck Guan Lim, Shiguo Liu, Vaidyanathan, K., Lau, J.H.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Development of 25-μm-Pitch Microbumps for 3-D Chip Stacking
AIBIN YU, KUMAR, Aditya, CHAN, Chien-Feng, CHAO, Chun-Chieh, CHIU, Chi-Hsin, CHAN, Chang-Yueh, CHANG, Chin-Huang, HUANG, Chih-Ming, CARL CHEN, SOON WEE HO, HNIN WAI YIN, LAU, John H, SU, Nandar, KHONG CHEE HOUE, JONG MING CHING, KRIPESH, Vaidyanathan, CHEN, Scott
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2012)
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Journal Article
Development of 25- \mu -Pitch Microbumps for 3-D Chip Stacking
Aibin Yu, Kumar, A., Soon Wee Ho, Hnin Wai Yin, Lau, J. H., Su, Nandar, Khong Chee Houe, Jong Ming Ching, Kripesh, V., Chen, S., Chien-Feng Chan, Chun-Chieh Chao, Chi-Hsin Chiu, Chang-Yueh Chan, Chin-Huang Chang, Chih-Ming Huang, Chen, C.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2012)
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Journal Article
Development of 25- mu rm m -Pitch Microbumps for 3-D Chip Stacking
Yu, Aibin, Kumar, Aditya, Ho, Soon Wee, Yin, Hnin Wai, Lau, John H, Su, Nandar, Houe, Khong Chee, Ching, Jong Ming, Kripesh, Vaidyanathan, Chen, Scott, Chan, Chien-Feng, Chao, Chun-Chieh, Chiu, Chi-Hsin, Chan, Chang-Yueh, Chang, Chin-Huang, Huang, Chih-Ming, Chen, Carl
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2012)
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Journal Article
Development of 25-[Formula Omitted]-Pitch Microbumps for 3-D Chip Stacking
Yu, Aibin, Kumar, Aditya, Ho, Soon Wee, Yin, Hnin Wai, Lau, John H, Su, Nandar, Houe, Khong Chee, Ching, Jong Ming, Kripesh, Vaidyanathan, Chen, Scott, Chan, Chien-Feng, Chao, Chun-Chieh, Chiu, Chi-Hsin, Chan, Chang-Yueh, Chang, Chin-Huang, Huang, Chih-Ming, Chen, Carl
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2012)
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Journal Article
Tagging module for lesion localization in capsule endoscopy
Chandrappan, J, Lim Ruiqi, Su, N, Tang Shao Qiang, Vaidyanathan, K
Published in 2010 Annual International Conference of the IEEE Engineering in Medicine and Biology (01.01.2010)
Published in 2010 Annual International Conference of the IEEE Engineering in Medicine and Biology (01.01.2010)
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Conference Proceeding
Journal Article
Development of 3-D silicon die stacked package using flip chip technology with micro bump interconnects
Vempati, S.R., Su, N., Chee Houe Khong, Ying Ying Lim, Vaidyanathan, K., Lau, J.H., Liew, B.P., Au, K.Y., Tanary, S., Fenner, A., Erich, R., Milla, J.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Development of thin film dielectric embedded 3D stacked package
Ho, Soon Wee, Su, Nandar, Lim, Li Shiah, Ong, Siong Chiew, Lee, Wen Sheng, Rao, Vempati Srinivasa
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)
Ying Ying Lim, Xianghua Xiao, Vempati, Srinivasa Rao, Su, Nandar, Kumar, Aditya, Sharma, Gaurav, Teck Guan Lim, Vaidyanathan, Kripesh, Jinglin Shi, Lau, John H, Shiguo Liu
Published in IEEE transactions on advanced packaging (01.11.2010)
Published in IEEE transactions on advanced packaging (01.11.2010)
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Journal Article
Millimeter wave dielectric characterization & demonstration of High-Q passives using a low loss thin film material
Ying, Lim Ying, Su, Nandar, Wee, David Ho Soon, Thaw, Phyo Phyo, Wang, Orson, Kuriyama, Hijiri, Yokotsuka, Shun, Shirashi, Kenichi
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Low temperature dielectric material for embedded micro wafer level packaging
Su, Nandar, Rao, Vempati Srinivas, Wee, Ho Soon, Sharma, Gaurav, Ying, Lim Ying, Kumar, Aditya, Damaruganath, Pinjala
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Embedded wafer level packages with laterally placed and vertically stacked thin dies
Sharma, G., Rao, V.S., Kumar, A., Su, N., Lim Ying Ying, Khong Chee Houe, Lim, S., Sekhar, V.N., Rajoo, R., Kripesh, V., Lau, J.H.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding