Improving the Rate of Eating Safety Guidance Implementation Among the Elderly
Chen, Ching-Yao, Wang, Ting-Yi, Chang, Pei-Chi, Lee, Tzu-Ping, Wang, Shu-Ming, Wu, Chao-Yen, Lin, Su-Li, Wu, Hsu-Hui
Published in Hu li za zhi (01.08.2021)
Published in Hu li za zhi (01.08.2021)
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Journal Article
Liver protection strategies in liver transplantation
Jia, Jun-Jun, Li, Jian-Hui, Jiang, Li, Lin, Bin-Yi, Wang, Li, Su, Rong, Zhou, Lin, Zheng, Shu-Sen
Published in Hepatobiliary & pancreatic diseases international (01.02.2015)
Published in Hepatobiliary & pancreatic diseases international (01.02.2015)
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Journal Article
提升高齡長者進食安全指導執行率
陳靜瑤(Ching-Yao CHEN), 王婷怡(Ting-Yi WANG), 張佩琪(Pei-Chi CHANG), 李紫萍(Tzu-Ping LEE), 王淑敏(Shu-Ming WANG), 吳昭燕(Chao-Yen WU), 林淑麗(Su-Li LIN), 吳徐慧(Hsu-Hui WU)
Published in 護理雜誌 (01.08.2021)
Published in 護理雜誌 (01.08.2021)
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Journal Article
Susceptibility-weighted Imaging in Thrombolytic Therapy of Acute Ischemic Stroke
Li, Lin, Liu, Ming-Su, Li, Guang-Qin, Zheng, Yang, Guo, Tong-Li, Kang, Xin, Yuan, Mao-Ting
Published in Chinese medical journal (20.10.2017)
Published in Chinese medical journal (20.10.2017)
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Journal Article
INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH AIR GAPS
Chen, Hsin-Ping, Su, Li-Lin, Yang, Tai-I, Wu, Yung-Hsu, Chuang, Cheng-Chi
Year of Publication 10.10.2024
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Year of Publication 10.10.2024
Patent
Integrated circuit interconnect structures with air gaps
Chen, Hsin-Ping, Su, Li-Lin, Yang, Tai-I, Wu, Yung-Hsu, Chuang, Cheng-Chi
Year of Publication 13.08.2024
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Year of Publication 13.08.2024
Patent
MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH VOIDS
Shue, Shau-Lin, Su, Li-Lin, Yang, Tai-I, Liu, Hsiang-Wei, Wu, Yung-Hsu, Chu, Wei-Chen
Year of Publication 14.03.2024
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Year of Publication 14.03.2024
Patent
Multi-metal fill with self-aligned patterning and dielectric with voids
Shue, Shau-Lin, Su, Li-Lin, Yang, Tai-I, Liu, Hsiang-Wei, Wu, Yung-Hsu, Chu, Wei-Chen
Year of Publication 02.01.2024
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Year of Publication 02.01.2024
Patent
Integrated Circuit Interconnect Structures with Air Gaps
Chen, Hsin-Ping, Su, Li-Lin, Yang, Tai-I, Wu, Yung-Hsu, Chuang, Cheng-Chi
Year of Publication 19.05.2022
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Year of Publication 19.05.2022
Patent
Integrated circuit interconnect structures with air gaps
Chen, Hsin-Ping, Su, Li-Lin, Yang, Tai-I, Wu, Yung-Hsu, Chuang, Cheng-Chi
Year of Publication 08.02.2022
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Year of Publication 08.02.2022
Patent
Multi-Metal Fill with Self-Aligned Patterning and Dielectric with Voids
Shue, Shau-Lin, YANG, Tai-I, Su, Li-Lin, Liu, Hsiang-Wei, Wu, Yung-Hsu, Chu, Wei-Chen
Year of Publication 03.11.2022
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Year of Publication 03.11.2022
Patent
Multi-metal fill with self-aligned patterning and dielectric with voids
Shue, Shau-Lin, Su, Li-Lin, Yang, Tai-I, Liu, Hsiang-Wei, Wu, Yung-Hsu, Chu, Wei-Chen
Year of Publication 23.08.2022
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Year of Publication 23.08.2022
Patent
Semiconductor device and manufacturing method thereof
Shue, Shau-Lin, Su, Li-Lin, Fu, Shih-Kang, Wu, Hsien-Chang, Lee, Ming-Han
Year of Publication 21.09.2021
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Year of Publication 21.09.2021
Patent