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MEMS Packaging Reliability in Board-Level Drop Tests Under Severe Shock and Impact Loading Conditions-Part I: Experiment
Jingshi Meng, Douglas, Stuart T., Dasgupta, Abhijit
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2016)
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Journal Article
Experiment and Simulation of Board Level Drop Tests With Intentional Board Slap at High Impact Accelerations
Douglas, Stuart T., Al-Bassyiouni, Moustafa, Dasgupta, Abhijit
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2014)
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Journal Article