A packaged optical slot-waveguide ring resonator sensor array for multiplex label-free assays in labs-on-chips
Carlborg, C F, Gylfason, K B, Kaźmierczak, A, Dortu, F, Bañuls Polo, M J, Maquieira Catala, A, Kresbach, G M, Sohlström, H, Moh, T, Vivien, L, Popplewell, J, Ronan, G, Barrios, C A, Stemme, G, van der Wijngaart, W
Published in Lab on a chip (01.01.2010)
Published in Lab on a chip (01.01.2010)
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Journal Article
Unconventional applications of wire bonding create opportunities for microsystem integration
Fischer, A C, Korvink, J G, Roxhed, N, Stemme, G, Wallrabe, U, Niklaus, F
Published in Journal of micromechanics and microengineering (01.08.2013)
Published in Journal of micromechanics and microengineering (01.08.2013)
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Journal Article
Fabrication of an infrared emitter using a generic integration platform based on wire bonding
Schröder, S, Rödjegård, H, Fischer, A C, Stemme, G, Niklaus, F
Published in Journal of micromechanics and microengineering (05.10.2016)
Published in Journal of micromechanics and microengineering (05.10.2016)
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Journal Article
A comparative study of the bonding energy in adhesive wafer bonding
Forsberg, F, Saharil, F, Haraldsson, T, Roxhed, N, Stemme, G, van der Wijngaart, W, Niklaus, F
Published in Journal of micromechanics and microengineering (01.08.2013)
Published in Journal of micromechanics and microengineering (01.08.2013)
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Journal Article
Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities
Oberhammer, J., Niklaus, F., Stemme, G.
Published in Sensors and actuators. A. Physical. (15.08.2003)
Published in Sensors and actuators. A. Physical. (15.08.2003)
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Journal Article
Low-temperature full wafer adhesive bonding
Niklaus, Frank, Enoksson, Peter, Kälvesten, Edvard, Stemme, Göran
Published in Journal of micromechanics and microengineering (01.03.2001)
Published in Journal of micromechanics and microengineering (01.03.2001)
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Journal Article
Micromachined electrodes for biopotential measurements
Griss, P., Enoksson, P., Tolvanen-Laakso, H.K., Merilainen, P., Ollmar, S., Stemme, G.
Published in Journal of microelectromechanical systems (01.03.2001)
Published in Journal of microelectromechanical systems (01.03.2001)
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Journal Article
Characterization of micromachined spiked biopotential electrodes
Griss, P., Tolvanen-Laakso, H.K., Merilainen, P., Stemme, G.
Published in IEEE transactions on biomedical engineering (01.06.2002)
Published in IEEE transactions on biomedical engineering (01.06.2002)
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Journal Article
Mechanically tri-stable, true single-pole-double-throw (SPDT) switches
Oberhammer, J, Tang, M, Liu, A-Q, Stemme, G
Published in Journal of micromechanics and microengineering (01.11.2006)
Published in Journal of micromechanics and microengineering (01.11.2006)
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Journal Article
Room-Temperature Sealing of Microcavities by Cold Metal Welding
Decharat, A., Junchun Yu, Boers, M., Stemme, G., Niklaus, F.
Published in Journal of microelectromechanical systems (01.12.2009)
Published in Journal of microelectromechanical systems (01.12.2009)
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Journal Article
Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding
Niklaus, F., Haasl, S., Stemme, G.
Published in Journal of microelectromechanical systems (01.08.2003)
Published in Journal of microelectromechanical systems (01.08.2003)
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Journal Article
Low temperature full wafer adhesive bonding of structured wafers
Niklaus, F., Andersson, H., Enoksson, P., Stemme, G.
Published in Sensors and actuators. A, Physical (01.08.2001)
Published in Sensors and actuators. A, Physical (01.08.2001)
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Journal Article
Conference Proceeding
Wire-bonded through-silicon vias with low capacitive substrate coupling
FISCHER, A. C, GRANGE, M, ROXHED, N, WEERASEKERA, R, PAMUNUWA, D, STEMME, G, NIKLAUS, F
Published in Journal of micromechanics and microengineering (01.08.2011)
Published in Journal of micromechanics and microengineering (01.08.2011)
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Journal Article