Carbon nanotubes in interconnect applications
Kreupl, F, Graham, A.P, Duesberg, G.S, Steinhögl, W, Liebau, M, Unger, E, Hönlein, W
Published in Microelectronic engineering (01.10.2002)
Published in Microelectronic engineering (01.10.2002)
Get full text
Journal Article
Conference Proceeding
Tungsten interconnects in the nano-scale regime
Steinhögl, W., Steinlesberger, G., Perrin, M., Scheinbacher, G., Schindler, G., Traving, M., Engelhardt, M.
Published in Microelectronic engineering (01.12.2005)
Published in Microelectronic engineering (01.12.2005)
Get full text
Journal Article
Conference Proceeding
Impact of line edge roughness on the resistivity of nanometer-scale interconnects
Steinhögl, W., Schindler, G., Steinlesberger, G., Traving, M., Engelhardt, M.
Published in Microelectronic engineering (01.10.2004)
Published in Microelectronic engineering (01.10.2004)
Get full text
Journal Article
Conference Proceeding
Electrical assessment of copper damascene interconnects down to sub-50 nm feature sizes
Steinlesberger, G., Engelhardt, M., Schindler, G., Steinhögl, W., von Glasow, A., Mosig, K., Bertagnolli, E.
Published in Microelectronic engineering (01.10.2002)
Published in Microelectronic engineering (01.10.2002)
Get full text
Journal Article
Conference Proceeding
Electrical characterization of copper interconnects with end-of-roadmap feature sizes
Schindler, G, Steinlesberger, G, Engelhardt, M, Steinhögl, W
Published in Solid-state electronics (01.07.2003)
Published in Solid-state electronics (01.07.2003)
Get full text
Journal Article
Phase analysis of TaN/Ta barrier layers in sub-micrometer trench structures for Cu interconnects
Traving, M., Zienert, I., Zschech, E., Schindler, G., Steinhögl, W., Engelhardt, M.
Published in Applied surface science (30.09.2005)
Published in Applied surface science (30.09.2005)
Get full text
Journal Article
Conference Proceeding
Processing technology for the investigation of sub-50 nm copper damascene interconnects
Steinlesberger, G, Engelhardt, M, Schindler, G, Kretz, J, Steinhögl, W, Bertagnolli, E
Published in Solid-state electronics (01.07.2003)
Published in Solid-state electronics (01.07.2003)
Get full text
Journal Article
Scaling of parasitics and delay times in the backend-of-line
Schindler, G, Steinhögl, W, Steinlesberger, G, Traving, M, Engelhardt, M
Published in Microelectronic engineering (01.10.2003)
Published in Microelectronic engineering (01.10.2003)
Get full text
Journal Article
Challenges of interconnection technology till the end of the roadmap and beyond
Engelhardt, M, Schindler, G, Steinhögl, W, Steinlesberger, G
Published in Microelectronic engineering (01.10.2002)
Published in Microelectronic engineering (01.10.2002)
Get full text
Journal Article
Conference Proceeding
Shifting the surface Kohn anomaly of H-saturated Mo( [formula omitted]) by alloying the bulk with Re
Okada, M., Flach, B., Hulpke, E., Steinhögl, W., Plummer, E.W.
Published in Surface science (01.02.2002)
Published in Surface science (01.02.2002)
Get full text
Journal Article
The low-energy thermal excitation spectrum of nitrogen molecules adsorbed on Ni(110) : implications for molecular adsorption sites
BERTINO, M, STEINHÖGL, W, RANGE, H, HOFMANN, F, WITTE, G, HULPKE, E, WÖLL, C
Published in Applied physics. A, Materials science & processing (01.02.1996)
Published in Applied physics. A, Materials science & processing (01.02.1996)
Get full text
Journal Article
Angle-resolved study of magnetic dichroism in photoemission using linearly polarized light
Kuch, W, Lin, M, Steinhögl, W, Schneider, CM, Venus, D, Kirschner, J
Published in Physical review. B, Condensed matter (01.01.1995)
Published in Physical review. B, Condensed matter (01.01.1995)
Get more information
Journal Article
Investigation of nano interconnects for an early experimental assessment of future interconnect challenges
Engelhardt, N., Schindler, G., Steinhogl, W., Steinlesberger, G., Traving, M.
Published in 2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866) (2004)
Published in 2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866) (2004)
Get full text
Conference Proceeding
Reliability studies of narrow Cu lines
Schindler, Günther, Penka, Sabine, Steinlesberger, Gernot, Traving, Martin, Steinhögl, Werner, Engelhardt, Manfred
Published in Microelectronic engineering (01.12.2005)
Published in Microelectronic engineering (01.12.2005)
Get full text
Journal Article
Conference Proceeding