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"STEARNS WILLIAM P"
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"STEARNS WILLIAM P"
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Optimized circuit design layout for high performance ball grid array packages
by
STEARNS WILLIAM P
,
HASSANZADEH NOZAR
Year of Publication
18.10.2011
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Optimized circuit design layout for high performance ball grid array packages
by
Stearns
,
William P
,
Hassanzadeh, Nozar
Year of Publication
18.10.2011
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Optimized circuit design layout for high performance ball grid array packages
by
STEARNS WILLIAM P
,
HASSANZADEH NOZAR
Year of Publication
03.11.2009
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Optimized circuit design layout for high performance ball grid array packages
by
Stearns
,
William P
,
Hassanzadeh, Nozar
Year of Publication
03.11.2009
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OPTIMIZED CIRCUIT DESIGN LAYOUT FOR HIGH PERFORMANCE BALL GRID ARRAY PACKAGES
by
NOZAR HASSANZADEE
,
STEARNS WILLIAM P
Year of Publication
15.10.2009
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Optimized Circuit Design Layout for High Performance Ball Grid Array Packages
by
STEARNS WILLIAM P
,
HASSANZADEH NOZAR
Year of Publication
02.07.2009
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Ball grid array package and method using enhanced power and ground distribution circuitry
by
STEARNS WILLIAM P
,
HASSANZADEH NOZAR
Year of Publication
05.11.2002
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Ball grid array package and method using enhanced power and ground distribution circuitry
by
Stearns
,
William P
,
Hassanzadeh, Nozar
Year of Publication
05.11.2002
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Optimized circuit design layout for high performance ball grid array packages
by
STEARNS WILLIAM P
,
HASSANZADEH NOZAR
Year of Publication
10.04.2001
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Ball grid array package and method using enhanced power and ground distribution circuitry
by
HASSANZADEH; NOZAR
,
STEARNS
;
WILLIAM P
Year of Publication
12.12.2000
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OPTIMAL CIRCUIT DESIGN LAYOUT FOR HIGH PERFORMANCE BALL GRID ARRAY PACKAGE
by
NOZAR HASSANZADEE
,
STEARNS WILLIAM P
Year of Publication
16.11.1999
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SEMICONDUCTOR PACKAGE WITH OFFSET DIE PAD AND METHOD FOR MANUFACTURING SAME
by
HALL E. JARMAN
,
WILLIAM P
.
STEARNS
Year of Publication
15.10.2002
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Prosthetic device for optimizing speech understanding through adjustable frequency spectrum responses
by
STEARNS
;
WILLIAM P
Year of Publication
20.11.1984
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Ball grid array package having a deformable metal layer and method
by
HASSANZADEH; NOZAR
,
KALIDAS; NAVINCHANDRA
,
STEARNS
;
WILLIAM P
Year of Publication
20.04.1999
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METHOD AND APPARATUS FOR PROVIDING ELECTRONIC SOUND CLARIFICATION FOR AURALLY HANDICAPPED PERSONS
by
STEARNS
,
WILLIAM P
Year of Publication
25.03.1975
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Semiconductor package with offset die pad
by
JARMAN; HALL E
,
HASSANZADEH; NOZAR
,
STEARNS
;
WILLIAM P
Year of Publication
29.08.2000
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Improvements in or relating to semiconductor device packaging
by
JARMAN, HALL E
,
STEARNS
,
WILLIAM P
,
HASSANTADEH, NOZAR
Year of Publication
05.04.2000
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SEMICONDUCTOR PACKAGE HAVING OFFSET DIE PAD AND ITS MANUFACTURE
by
HASSANTADEH NOZAR
,
JARMAN HALL E
,
STEARNS WILLIAM P
Year of Publication
25.09.1998
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Improvements in or relating to semiconductor device packaging
by
JARMAN, HALL E
,
STEARNS
,
WILLIAM P
,
HASSANTADEH, NOZAR
Year of Publication
22.07.1998
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METHOD FOR PROVIDING ELECTRONIC RESTORATION OF SPEECH DISCRIMINATION IN AURALLY HANDICAPPED PERSONS
by
STEARNS
,
WILLIAM P
,
ELPERN, BARRY S
Year of Publication
17.02.1976
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