Search Results - "STANLEY SEUNGCHUL SONG" :: K.UTB vyhledávací portál

BS-PDN Implemented the Latest Logic Devices for 14 Angstrom Technology Node

by Lee, Junjong, Seungchul Song, Stanley, Baek, Rock-Hyun
Published in IEEE transactions on electron devices (01.07.2024)

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Journal Article

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Unified technology optimization platform using integrated analysis (UTOPIA) for holistic pathfinding DTCO of advanced transistors

by Song, Stanley Seungchul
Published in 2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) (01.04.2018)

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Conference Proceeding

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Unified technology optimization platform using integrated analysis (UTOPIA) for holistic pathfinding DTCO of advanced transistors

by Song, Stanley Seungchul
Published in 2018 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) (01.04.2018)

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Conference Proceeding

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INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING FRONT SIDE BACK-END-OF-LINE (FS-BEOL) TO BACK SIDE BACK-END-OF-LINE (BS-BEOL) STACKING FOR THREE-DIMENSIONAL (3D) DIE STACKING, AND RELATED FABRICATION METHODS

by CHAVA, Bharani, SONG, Stanley Seungchul
Year of Publication 27.09.2023

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Patent

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Integrated circuit (IC) packages employing front side back-end-of-line (FS-BEOL) to back side back-end-of-line (BS-BEOL) stacking for three-dimensional (3D) die stacking, and related fabrication methods

by Chava, Bharani, Song, Stanley Seungchul
Year of Publication 10.01.2023

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Patent

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INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING FRONT SIDE BACK-END-OF-LINE (FS-BEOL) TO BACK SIDE BACK-END-OF-LINE (BS-BEOL) STACKING FOR THREE-DIMENSIONAL (3D) DIE STACKING, AND RELATED FABRICATION METHODS

by CHAVA, Bharani, SONG, Stanley Seungchul
Year of Publication 27.05.2022

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Patent

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INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING FRONT SIDE BACK-END-OF-LINE (FS-BEOL) TO BACK SIDE BACK-END-OF-LINE (BS-BEOL) STACKING FOR THREE-DIMENSIONAL (3D) DIE STACKING, AND RELATED FABRICATION METHODS

by Chava, Bharani, Song, Stanley Seungchul
Year of Publication 26.05.2022

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Patent

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THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS

by Sun, Yangyang, Song, Stanley Seungchul, Zhao, Lily
Year of Publication 21.09.2023

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Patent

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Gate-all-around (GAA) transistors with shallow source/drain regions and methods of fabricating the same

by Rim, Kern, Song, Stanley Seungchul, Feng, Peijie
Year of Publication 03.01.2023

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Patent

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Integrated device comprising a CMOS structure comprising well-less transistors

by Song, Stanley Seungchul, Feng, Peijie, Park, Hyunwoo
Year of Publication 15.11.2022

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Patent

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PACKAGE COMPRISING INTEGRATED DEVICES AND BRIDGE COUPLING TOP SIDES OF INTEGRATED DEVICES

by KIM, Jonghae, CHAVA, Bharani, SONG, Stanley Seungchul, ROY, Abinash
Year of Publication 01.05.2024

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Patent

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Deep trench capacitors in an inter-layer medium on an interconnect layer of an integrated circuit die and related methods

by Choi, Jihong, Nallapati, Giridhar, Song, Stanley Seungchul, Chidambaram, Periannan
Year of Publication 30.04.2024

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Patent

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SELF-ALIGNED BACKSIDE CONTACT FOR 3DIC APPLICATION

by LIANG, Qingqing, IMTHURN, George Pete, SONG, Stanley Seungchul, CHIDAMBARAM, Periannan
Year of Publication 28.03.2024

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Patent

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DEEP TRENCH CAPACITORS IN AN INTER-LAYER MEDIUM ON AN INTERCONNECT LAYER OF AN INTEGRATED CIRCUIT DIE AND RELATED METHODS

by NALLAPATI, Giridhar, SONG, Stanley Seungchul, CHIDAMBARAM, Periannan, CHOI, Jihong
Year of Publication 27.03.2024

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Patent

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SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION

by LIANG, Qingqing, IMTHURN, George Pete, SONG, Stanley Seungchul, CHIDAMBARAM, Periannan
Year of Publication 21.03.2024

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Patent

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INTEGRATED DEVICE COMPRISING A CMOS STRUCTURE COMPRISING WELL-LESS TRANSISTORS

by PARK, Hyunwoo, SONG, Stanley Seungchul, FENG, Peijie
Year of Publication 29.06.2022

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Patent

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PACKAGE COMPRISING INTEGRATED DEVICES AND BRIDGE COUPLING TOP SIDES OF INTEGRATED DEVICES

by KIM, Jonghae, CHAVA, Bharani, SONG, Stanley Seungchul, ROY, Abinash
Year of Publication 15.02.2024

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Patent

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Three-dimensional (3D) integrated circuit (IC) integration of an embedded chip and a preformed metal routing structure

by Song, Stanley Seungchul, Kim, Jonghae, Chidambaram, Periannan
Year of Publication 19.04.2022

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Patent

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Package comprising integrated devices and bridge coupling top sides of integrated devices

by Chava, Bharani, Roy, Abinash, Song, Stanley Seungchul, Kim, Jonghae
Year of Publication 28.11.2023

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Patent

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THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE EMPLOYING A REDISTRIBUTION LAYER (RDL) INTERPOSER FACILITATING SEMICONDUCTOR DIE STACKING, AND RELATED FABRICATION METHODS

by KIM, Jonghae, LAN, Je-Hsiung, SONG, Stanley Seungchul, CHIDAMBARAM, Periannan
Year of Publication 12.10.2023

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Patent

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