A PCB-Embedded 1.2 kV SiC MOSFET Package with Reduced Manufacturing Complexity
Knoll, Jack, DiMarino, Christina, Stahr, Hannes, Morianz, Mike
Published in IEEE open journal of power electronics (01.01.2023)
Published in IEEE open journal of power electronics (01.01.2023)
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Journal Article
A PCB-Embedded 1.2 kV SiC MOSFET Half-Bridge Package for a 22 kW AC-DC Converter
Knoll, Jack S., Son, Gibong, DiMarino, Christina, Li, Qiang, Stahr, Hannes, Morianz, Mike
Published in IEEE transactions on power electronics (01.10.2022)
Published in IEEE transactions on power electronics (01.10.2022)
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Journal Article
Thermal and Mechanical characterization of embedded PTCQ packaging test chip die
Weis, Gerald, Schwarz, Timo, Cherman, Vladimir, Stahr, Hannes, Van Der Plas, Geert
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Design and Analysis of a PCB-Embedded 1.2 kV SiC Half-Bridge Module
Knoll, Jack, Son, Gibong, DiMarino, Christina, Li, Qiang, Stahr, Hannes, Morianz, Mike
Published in 2021 IEEE Energy Conversion Congress and Exposition (ECCE) (10.10.2021)
Published in 2021 IEEE Energy Conversion Congress and Exposition (ECCE) (10.10.2021)
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Conference Proceeding
Embedded power electronics on the way to be launched
Morianz, Mike, Stahr, Hannes
Published in 2015 European Microelectronics Packaging Conference (EMPC) (01.09.2015)
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Published in 2015 European Microelectronics Packaging Conference (EMPC) (01.09.2015)
Conference Proceeding
COMPONENT EMBEDDED IN COMPONENT CARRIER AND HAVING AN EXPOSED SIDE WALL
Leitgeb, Markus, Zluc, Andreas, Schuster, Bettina, Stahr, Hannes, Silvano De Sousa, Jonathan
Year of Publication 20.03.2024
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Year of Publication 20.03.2024
Patent
Component Embedded in Component Carrier and Having an Exposed Side Wall
Leitgeb, Markus, Zluc, Andreas, Schuster, Bettina, Silvano de Sousa, Jonathan, Stahr, Hannes
Year of Publication 04.05.2023
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Year of Publication 04.05.2023
Patent
Component embedded in component carrier and having an exposed side wall
Leitgeb, Markus, Zluc, Andreas, Schuster, Bettina, Silvano de Sousa, Jonathan, Stahr, Hannes
Year of Publication 31.01.2023
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Year of Publication 31.01.2023
Patent
Miniaturized power-diode package with superior thermal performance using embedding technology
Unger, Michael, Stahr, Hannes, Morianz, Mike, Nicolics, Johann, Dosseul, Franck
Published in 2016 39th International Spring Seminar on Electronics Technology (ISSE) (01.05.2016)
Published in 2016 39th International Spring Seminar on Electronics Technology (ISSE) (01.05.2016)
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Conference Proceeding