Search Results - "ST. AMAND, Roger D" :: K.UTB vyhledávací portál

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Semiconductor devices and methods of manufacturing semiconductor devices

by St. Amand, Roger D, Nicholls, Louis W
Year of Publication 16.01.2024

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Patent

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Stackable package and method

by St. Amand, Roger D, Perelman, Vladimir, Darveaux, Robert Francis
Year of Publication 11.06.2024

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Patent

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Semiconductor devices and methods of manufacturing semiconductor devices

by St. Amand, Roger D, Nicholls, Louis W
Year of Publication 14.06.2022

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Patent

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SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

by St. Amand, Roger D, Nicholls, Louis W
Year of Publication 02.09.2021

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Patent

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Thin bonded interposer package

by St. Amand, Roger D, Berry, Christopher J, Kim, Jin Seong
Year of Publication 04.04.2023

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Patent

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THIN BONDED INTERPOSER PACKAGE

by St. Amand, Roger D, Berry, Christopher J, Kim, Jin Seong
Year of Publication 15.04.2021

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Patent

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Thin bonded interposer package

by St. Amand, Roger D, Berry, Christopher J, Kim, Jin Seong
Year of Publication 27.10.2020

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Patent

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Methods and structures for increasing the allowable die size in TMV packages

by Darveaux, Robert F, Jung, Woon Kab, St. Amand, Roger D, Nicholls, Louis W, Kim, Jin Seong, Yang, Sung Jin
Year of Publication 01.11.2022

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Patent

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THIN BONDED INTERPOSER PACKAGE

by St. Amand, Roger D, Berry, Christopher J, Kim, Jin Seong
Year of Publication 14.11.2019

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Patent

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Thin bonded interposer package

by St. Amand, Roger D, Berry, Christopher J, Kim, Jin Seong
Year of Publication 26.03.2019

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Patent

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METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV PACKAGES

by Darveaux, Robert F, Jung, Woon Kab, St. Amand, Roger D, Nicholls, Louis W, Kim, Jin Seong, Yang, Sung Jin
Year of Publication 03.06.2021

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Patent

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Semiconductor devices and methods of making semiconductor devices

by Darveaux, Robert F, Jung, Woon Kab, St. Amand, Roger D, Nicholls, Louis W, Kim, Jin Seong, Yang, Sung Jin
Year of Publication 14.07.2020

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Patent

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METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV PACKAGES

by Darveaux, Robert F, Jung, Woon Kab, St. Amand, Roger D, Nicholls, Louis W, Kim, Jin Seong, Yang, Sung Jin
Year of Publication 05.12.2019

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Patent

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Stackable package and method

by Perelman Vladimir, St. Amand Roger D, Darveaux Robert Francis
Year of Publication 15.11.2016

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Patent

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Methods and structures for increasing the allowable die size in TMV packages

by Darveaux, Robert F, Jung, Woon Kab, St. Amand, Roger D, Nicholls, Louis W, Kim, Jin Seong, Yang, Sung Jin
Year of Publication 09.07.2019

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Patent

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Methods and structures for increasing the allowable die size in TMV packages

by Yang Sung Jin, St. Amand Roger D, Jung Woon Kab, Nicholls Louis W, Darveaux Robert F, Kim Jin Seong
Year of Publication 01.08.2017

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Patent

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Semiconductor package with fast power-up cycle and method of making same

by St. Amand, Roger D, Perelman, Vladimir
Year of Publication 27.12.2011

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Patent

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Package in package device for RF transceiver module

by Roa, Fernando, St. Amand, Roger D
Year of Publication 15.11.2011

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Patent

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SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

by ST. AMAND, Roger D, NICHOLLS, Louis W
Year of Publication 16.05.2024

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Patent

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Stacked flip chip die assembly

by St. Amand, Roger D, Perelman, Vladimir
Year of Publication 28.12.2010

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Patent

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