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Knickerbocker, J U, Andry, P S, Dang, B, Horton, R R, Interrante, M J, Patel, C S, Polastre, R J, Sakuma, K, Sirdeshmukh, R, Sprogis, E J, Sri-Jayantha, S M, Stephens, A M, Topol, A W, Tsang, C K, Webb, B C, Wright, S L
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
Knickerbocker, J. U., Andry, P. S., Buchwalter, L. P., Deutsch, A., Horton, R. R., Jenkins, K. A., Kwark, Y. H., McVicker, G., Patel, C. S., Polastre, R. J., Schuster, C. D., Sharma, A., Sri-Jayantha, S. M., Surovic, C. W., Tsang, C. K., Webb, B. C., Wright, S. L., McKnight, S. R., Sprogis, E. J., Dang, B.
Published in IBM journal of research and development (01.07.2005)
Published in IBM journal of research and development (01.07.2005)
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Thermomechanical modeling of 3D electronic packages
Sri-Jayantha, S M, McVicker, G, Bernstein, K, Knickerbocker, J U
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Impact of Organic Substrate Warp on C4 Non-Wets
Khanna, V. D., Sri-Jayantha, Sri M.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2011)
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Heat Sink Induced Thermomechanical Joint Strain in QFN Devices
McVicker, Gerard, Khanna, Vijay, Sri-Jayantha, M.
Published in Journal of microelectronics and electronic packaging (01.04.2014)
Published in Journal of microelectronics and electronic packaging (01.04.2014)
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TrueTrack servo technology for high TPI disk drives
SRI-JAYANTHA, Sri M, HIEN DANG, SHARMA, Arun, YONEDA, Isao, KITAZAKI, Nabuyuki, YAMAMOTO, Satoshi
Published in IEEE transactions on magnetics (01.03.2001)
Published in IEEE transactions on magnetics (01.03.2001)
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Conference Proceeding
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Impact of Organic Substrate Warp on C4 Non-Wets : Best-of-Session Papers from the 60th Electronic Components and Technology Conference
KHANNA, Vijay D, SRI-JAYANTHA, Sri M
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (2011)
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Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (2011)
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Novel mass reflow method for organic substrates
Khanna, Vijay D., Sri-Jayantha, Sri M.
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding