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Published in IEEE journal of solid-state circuits (01.08.2006)
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Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
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Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Fabrication and characterization of robust through-silicon vias for silicon-carrier applications
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Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
Knickerbocker, J. U., Andry, P. S., Buchwalter, L. P., Deutsch, A., Horton, R. R., Jenkins, K. A., Kwark, Y. H., McVicker, G., Patel, C. S., Polastre, R. J., Schuster, C. D., Sharma, A., Sri-Jayantha, S. M., Surovic, C. W., Tsang, C. K., Webb, B. C., Wright, S. L., McKnight, S. R., Sprogis, E. J., Dang, B.
Published in IBM journal of research and development (01.07.2005)
Published in IBM journal of research and development (01.07.2005)
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3D chip stacking with C4 technology
Dang, B, Wright, S L, Andry, P S, Sprogis, E J, Tsang, C K, Interrante, M J, Webb, B C, Polastre, R J, Horton, R R, Patel, C S, Sharma, A, Zheng, J, Sakuma, K, Knickerbocker, J U
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Area array solder interconnection technology for the three-dimensional silicon cube
Howell, Wayne J, Brouillette, Donald W, Korejwa, Josef W, Sprogis, Edmund J, Yankee, Sally J, Wursthorn, John M
Published in Electronic Components & Technology Conference. Proceedings. pp. 1174-1178. 1995 (01.01.1995)
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Published in Electronic Components & Technology Conference. Proceedings. pp. 1174-1178. 1995 (01.01.1995)
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Integrated DC-DC Power Converters Through Face-to-Face Bonding
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Year of Publication 20.11.2018
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Year of Publication 14.08.2018
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