A Study of Metal on Metal Multiple Patterning Scheme
Chen, James Hsueh-Chung, Silvestre, Mary-Claire, Ghosh, Somnath, Mignot, Yann, Kelly, James J., Clevenger, Lawrence A., Spooner, Terry A.
Published in 2020 IEEE International Interconnect Technology Conference (IITC) (05.10.2020)
Published in 2020 IEEE International Interconnect Technology Conference (IITC) (05.10.2020)
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Conference Proceeding
Conduction Mechanisms of Ta/Porous SiCOH Films under Electrical Bias
Ou, Ya, Wang, Pei-I., He, Ming, Lu, T.-M., Leung, Pak, Spooner, Terry A.
Published in Journal of the Electrochemical Society (2008)
Published in Journal of the Electrochemical Society (2008)
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Journal Article
Rework for metal interconnects using etch and thermal anneal
Clevenger, Lawrence A, Bhosale, Prasad, Yang, Chih-Chao, Spooner, Terry A
Year of Publication 13.02.2024
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Year of Publication 13.02.2024
Patent
Contacts having a geometry to reduce resistance
Peterson, Kirk D, Clevenger, Lawrence A, Wang, Junli, Spooner, Terry A, Li, Baozhen
Year of Publication 16.01.2024
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Year of Publication 16.01.2024
Patent
Interconnect structures including self aligned vias
Yang, Chih-Chao, Spooner, Terry A, Chen, Shyng-Tsong, Motoyama, Koichi
Year of Publication 22.08.2023
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Year of Publication 22.08.2023
Patent
SELF-ALIGNED DOUBLE PATTERNING (SADP) INTEGRATION WITH WIDE LINE SPACING
Yang, Chih-Chao, Spooner, Terry A, Chen, Shyng-Tsong, Motoyama, Koichi
Year of Publication 04.05.2023
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Year of Publication 04.05.2023
Patent
The Effect of Material and Process Interactions on BEOL Integration
Spooner, Terry A., Arnold, John C., Canaperi, Donald, Chen, James, Chen, Shyng-Tsong, Gates, Stephen M., Isobayashi, Atsunobu, Leung, Pak, Papa Rao, Satyavolu S., Sankarapandian, Muthumanickam, Shobha, Hosadurga, Van der Straten, O.
Published in ECS transactions (01.01.2009)
Published in ECS transactions (01.01.2009)
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Journal Article
Metal on metal multiple patterning
Chen, Hsueh-Chung, Reidy, Sean, Spooner, Terry A, Ghosh, Somnath, Licausi, Nicholas V, Srivastava, Ravi P
Year of Publication 26.07.2022
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Year of Publication 26.07.2022
Patent
INTERCONNECT STRUCTURES INCLUDING SELF ALIGNED VIAS
Yang, Chih-Chao, Spooner, Terry A, Chen, Shyng-Tsong, Motoyama, Koichi
Year of Publication 24.03.2022
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Year of Publication 24.03.2022
Patent
Double patterning interconnect integration scheme with SAV
Yang, Chih-Chao, Spooner, Terry A, Chen, Shyng-Tsong, Motoyama, Koichi
Year of Publication 08.02.2022
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Year of Publication 08.02.2022
Patent
Interconnect performance and scaling strategy at 7 nm node
Chen, James Hsueh-Chung, Standaert, Theodorus E., Alptekin, Emre, Spooner, Terry A., Paruchuri, Vamsi
Published in IEEE International Interconnect Technology Conference (01.05.2014)
Published in IEEE International Interconnect Technology Conference (01.05.2014)
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Conference Proceeding
Interconnect structures including self aligned vias
Yang, Chih-Chao, Spooner, Terry A, Chen, Shyng-Tsong, Motoyama, Koichi
Year of Publication 18.01.2022
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Year of Publication 18.01.2022
Patent
CONTACTS HAVING A GEOMETRY TO REDUCE RESISTANCE
Peterson, Kirk D, Clevenger, Lawrence A, Wang, Junli, Spooner, Terry A, Li, Baozhen
Year of Publication 02.09.2021
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Year of Publication 02.09.2021
Patent
Contacts having a geometry to reduce resistance
Peterson, Kirk D, Clevenger, Lawrence A, Wang, Junli, Spooner, Terry A, Li, Baozhen
Year of Publication 13.07.2021
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Year of Publication 13.07.2021
Patent
DOUBLE PATTERNING INTERCONNECT INTEGRATION SCHEME WITH SAV
Yang, Chih-Chao, Spooner, Terry A, Chen, Shyng-Tsong, Motoyama, Koichi
Year of Publication 22.04.2021
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Year of Publication 22.04.2021
Patent