A Study of Metal on Metal Multiple Patterning Scheme
Chen, James Hsueh-Chung, Silvestre, Mary-Claire, Ghosh, Somnath, Mignot, Yann, Kelly, James J., Clevenger, Lawrence A., Spooner, Terry A.
Published in 2020 IEEE International Interconnect Technology Conference (IITC) (05.10.2020)
Published in 2020 IEEE International Interconnect Technology Conference (IITC) (05.10.2020)
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Conference Proceeding
Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes
Nogami, Takeshi, Briggs, Benjamin D., Korkmaz, Sevim, Chae, Moosung, Penny, Christopher, Juntao Li, Wei Wang, McLaughlin, Paul S., Kane, Terence, Parks, Christopher, Madan, Anita, Cohen, Stephan, Shaw, Thomas, Priyadarshini, Deepika, Shobha, Hosadurga, Son Nguyen, Patlolla, Raghuveer, Kelly, James, Xunyuan Zhang, Spooner, Terry, Canaperi, Donald, Standaert, Theodorus, Huang, Elbert, Paruchuri, Vamsi, Edelstein, Daniel
Published in 2015 IEEE International Electron Devices Meeting (IEDM) (01.12.2015)
Published in 2015 IEEE International Electron Devices Meeting (IEDM) (01.12.2015)
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Conference Proceeding
Journal Article
Conduction Mechanisms of Ta/Porous SiCOH Films under Electrical Bias
Ou, Ya, Wang, Pei-I., He, Ming, Lu, T.-M., Leung, Pak, Spooner, Terry A.
Published in Journal of the Electrochemical Society (2008)
Published in Journal of the Electrochemical Society (2008)
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Journal Article
56 nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme
LOQUET, Yannick, MIGNOT, Yann, MORRIS, Bryan, KLEEMEIER, Walter, LINIGER, E, SPOONER, Terry, WASKIEWICZ, Christopher, CHEN, James Hsueh-Chung, SANKARAPANDIAN, Muthumanickam, CHEN, Shyng-Tsong, FLAITZ, Philip, TOMIZAWA, Hideyuki, TSENG, Chia-Hsun, BEARD, Marcy
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
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Conference Proceeding
Journal Article
56nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme
Loquet, Yannick, Mignot, Yann, Waskiewicz, Christopher, Chen, James Hsueh-Chung, Sankarapandian, Muthumanickam, Chen, Shyng-Tsong, Flaitz, Philip, Tomizawa, Hideyuki, Tseng, Chia-Hsun, Beard, Marcy, Morris, Bryan, Kleemeier, Walter, Liniger, E., Spooner, Terry
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
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Journal Article
Line Resistance and Electromigration Variations Induced by Hydrogen-Based Plasma Modifications to the Silicon Carbonitride/Copper Interface
Ryan, E. Todd, Martin, Jeremy, Bonilla, Griselda, Molis, Steven, Spooner, Terry, Widodo, Johnny, Kim, Jae-Hak, Liniger, Eric, Grill, Alfred, Hu, C.-K.
Published in Journal of the Electrochemical Society (2007)
Published in Journal of the Electrochemical Society (2007)
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Journal Article
Integration of Photo-Patternable Low-$\kappa$ Material into Advanced Cu Back-End-Of-The-Line
Lin, Qinghuang, Nelson, Alshakim, Chen, Shyng-Tsong, Brock, Philip, Cohen, Stephan A, Davis, Blake, Kaplan, Richard, Kwong, Ranee, Liniger, Eric, Neumayer, Debra, Patel, Jyotica, Shobha, Hosadurga, Sooriyakumaran, Ratnam, Purushothaman, Sampath, Miller, Robert, Spooner, Terry, Wisnieff, Robert
Published in Japanese Journal of Applied Physics (01.05.2010)
Published in Japanese Journal of Applied Physics (01.05.2010)
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Journal Article
Robust Ultrathin (20-25 nm)Trilayer Dielectric Low k Cu Damascene Cap for Sub-30 nm Nanoelectric Devices
Nguyen, Son V., Haigh, Thomas, Tagami, Masayoshi, Grill, Alfred, Cohen, Stephan, Shobha, Hosadurga, Hu, Chao-Kun, Adams, Ed, Liniger, Eric, Shaw, Thomas, Cheng, Tien, Yusuff, Hakeem, Xu, Yiheng, Ko, Tze-Man, Molis, Steven, Spooner, Terry, Skordas, Spyridon, Liu, Xiao Hu, Bonilla, Griselda, Edelstein, Dan
Published in ECS transactions (04.05.2012)
Published in ECS transactions (04.05.2012)
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Journal Article
Structural stability of tight-pitched damascene interconnects
Mukesh, Sagarika, Lanzillo, Nicholas A., Motayama, Koichi, Spooner, Terry
Published in 2020 IEEE International Interconnect Technology Conference (IITC) (05.10.2020)
Published in 2020 IEEE International Interconnect Technology Conference (IITC) (05.10.2020)
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Conference Proceeding
Rework for metal interconnects using etch and thermal anneal
Clevenger, Lawrence A, Bhosale, Prasad, Yang, Chih-Chao, Spooner, Terry A
Year of Publication 13.02.2024
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Year of Publication 13.02.2024
Patent
Contacts having a geometry to reduce resistance
Peterson, Kirk D, Clevenger, Lawrence A, Wang, Junli, Spooner, Terry A, Li, Baozhen
Year of Publication 16.01.2024
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Year of Publication 16.01.2024
Patent
Ruthenium interconnect resistivity and reliability at 48 nm pitch
Xunyuan Zhang, Huai Huang, Patlolla, Raghuveer, Wei Wang, Mont, Frank W., Juntao Li, Chao-Kun Hu, Liniger, Eric G., McLaughlin, Paul S., Labelle, Cathy, Ryan, E. Todd, Canaperi, Donald, Spooner, Terry, Bonilla, Griselda, Edelstein, Daniel
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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Conference Proceeding
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Interconnect structures including self aligned vias
Yang, Chih-Chao, Spooner, Terry A, Chen, Shyng-Tsong, Motoyama, Koichi
Year of Publication 22.08.2023
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Year of Publication 22.08.2023
Patent
SELF-ALIGNED DOUBLE PATTERNING (SADP) INTEGRATION WITH WIDE LINE SPACING
Yang, Chih-Chao, Spooner, Terry A, Chen, Shyng-Tsong, Motoyama, Koichi
Year of Publication 04.05.2023
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Year of Publication 04.05.2023
Patent
The Effect of Material and Process Interactions on BEOL Integration
Spooner, Terry A., Arnold, John C., Canaperi, Donald, Chen, James, Chen, Shyng-Tsong, Gates, Stephen M., Isobayashi, Atsunobu, Leung, Pak, Papa Rao, Satyavolu S., Sankarapandian, Muthumanickam, Shobha, Hosadurga, Van der Straten, O.
Published in ECS transactions (01.01.2009)
Published in ECS transactions (01.01.2009)
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Journal Article